Back |
Home
/ Download
/ Film Thickness Tester
/ Filmetrics F54 Thin Film Mapping System Product Brochure

Filmetrics F54 Thin Film Mapping System Product Brochure

Brief Description ：: Download official product brochure for Filmetrics F54 automatic thin film mapping system with motorized R-Theta stage supporting wafers up to 450 mm. Standard 380–1050 nm spectrum covers 20 nm–45 μm film thickness, with optional UV/NIR full-spectrum modules, micro spot down to 2 μm, autofocus and built-in vision camera. FILMapper software delivers fast 2 points/sec mapping for semiconductor, display and optical coating R&D & pilot production. This brochure contains full optical specs, objective lens options, calibration standards and cross-industry application cases.

File version ：: V1.0.1

File type ：: PDF

Download

The Filmetrics F54 is a high-performance automated thin-film thickness mapping platform from KLA Filmetrics, integrating microscopic micro-spot optics, integrated imaging camera, motorized Z autofocus and precision R-Theta rotary stage for full-wafer thin film uniformity characterization on substrates up to 450 mm diameter. Built on proven spectral reflectance technology, the base F54 configuration operates at 380–1050 nm visible spectrum, measuring transparent single/multi-layer dielectrics from 20 nm to 45 μm while simultaneously calculating refractive index (n), extinction coefficient (k) and surface reflectance without destructive sampling.

Multiple upgradeable wavelength variants extend measurement capacity: F54-UV (190–1100 nm, 4 nm–35 μm) for ultra-thin gate oxides, F54-NIR (950–1700 nm, 100 nm–115 μm) for thick polymer and passivation coatings, plus full-spectrum F54-EXR / F54-UVX covering 4 nm–115 μm across far UV to near infrared. Interchangeable objective lenses paired with variable aperture sizes deliver adjustable micro spot sizes ranging from 2 μm up to 500 μm, enabling precise measurement on tiny patterned die structures, micro MEMS features and full unpatterned wafer surfaces.

The motorized R-Theta stage automatically navigates pre-programmed rectangular, linear, polar mapping layouts or fully custom user-defined point arrays, achieving a high throughput of two measurement points per second with seamless 2D/3D thickness uniformity contour generation. Equipped with a built-in digital vision system and motorized autofocus Z-axis, the tool eliminates manual positioning errors and supports stable repeated batch testing. The bundled FILMapper software includes a library of over 130 pre-calibrated material models (SiO₂, SiN, photoresist, polyimide, polysilicon), one-click automatic baseline calibration, batch measurement sequencing and customizable data export & reporting functions.

Compact desktop layout with simple USB computer connection allows rapid lab setup, with standard accessories including calibrated thickness reference wafers, reflectance standards and vacuum sample chucks. This official brochure details complete optical parameters, objective lens specifications, wavelength module selection guides, standardized calibration workflows and comprehensive application solutions for semiconductor lithography & deposition, MEMS passivation films, OLED polyimide layers, photovoltaic anti-reflection coatings and precision optical hard coats. One-click PDF download is available for laboratory equipment evaluation, process recipe development and pilot production quality monitoring.