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Filmetrics F54-XY-200 Thin Film Mapping System Product Brochure

Brief Description ：: Download official product brochure for Filmetrics F54-XY-200 compact automated mapping system with motorized XY stage for samples up to 200mm. It delivers 4nm–120μm film thickness, n&k optical constant measurement via interchangeable UV-VIS-NIR wavelength modules, supporting micro-spot 2μm–100μm testing on patterned/unpatterned wafers at 2 points/sec. This brochure covers optical specs, FILMapper software, pattern recognition and semiconductor, display & optical coating application cases for lab and pilot production.

File version ：: V1.0.1

File type ：: PDF

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The Filmetrics F54-XY-200 is a compact benchtop automated thin-film mapping platform under KLA Filmetrics portfolio, built on mature spectral reflectometry technology to characterize film thickness, refractive index (n), extinction coefficient (k), reflectance and surface roughness for both patterned and unpatterned substrates up to 200 mm × 200 mm. Equipped with a high-precision motorized XY motion stage, the system automatically navigates to pre-defined or user-customized measurement coordinates and achieves fast scanning throughput up to two measurement points per second, supporting rectangular, linear, polar and unlimited custom mapping layouts without stitching restrictions.

Five configurable optical variants cover diverse measurement demands: standard VIS 380–1050nm for general dielectric films, UV 190–1100nm for ultra-thin layers down to 4 nm, NIR 950–1700nm for thick coatings, EXR and UVX full-spectrum 190–1700nm combinations spanning 4 nm to 120 μm thickness range. Multiple objective lenses deliver variable micro-spot sizes from 2 μm to 100 μm, paired with motorized auto-focus and built-in vision camera for accurate targeting on tiny patterned die structures, eliminating blind measurement errors.

The bundled FILMapper software integrates a database of over 130 pre-calibrated material models including SiO₂, SiN, photoresist, polyimide and polysilicon, featuring automatic baseline calibration, 2D/3D thickness uniformity contour plotting, batch sequencing and customizable data export. Integrated pattern recognition enables stable alignment on structured semiconductor wafers, display panels and optical substrates. All hardware adopts compact desktop layout with simple USB connection for quick lab setup, with optional vacuum chucks and temperature control fixtures available for special process testing.

This official brochure details full mechanical dimensions, light source configurations, objective aperture selections, standard calibration reference wafers and complete application solutions covering semiconductor gate dielectrics, MEMS passivation films, OLED polyimide layers, photovoltaic anti-reflection coatings and precision optical hard coats, with one-click PDF download available for laboratory R&D evaluation and pilot production quality monitoring.