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Filmetrics F60-t Thin Film Mapping System Product Brochure

Brief Description ：: Download official product brochure for Filmetrics F60-t production thin film mapping system upgraded from F50 platform, equipped with motorized R-Theta stage, auto notch detection, enclosed interlock chamber and SECS/GEM factory communication. It delivers 20nm–70μm film thickness & n/k optical constant measurement at 380–1050nm, supporting full-wafer uniformity mapping for semiconductor, display and optical coating mass production. This brochure covers optical specs, FILMapper software, automated calibration, production accessories and fab application cases.

File version ：: V1.0.1

File type ：: PDF

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The Filmetrics F60-t is a production-oriented automated thin-film mapping platform built upon the proven F50 lab mapping architecture, optimized exclusively for 24/7 continuous semiconductor and display manufacturing lines. Powered by advanced spectral reflectance technology with 380–1050nm standard wavelength coverage, it accurately extracts film thickness, refractive index (n) and extinction coefficient (k) across a wide measuring range of 20 nm to 70 μm, compatible with single-layer and multi-layer transparent dielectric stacks such as SiO₂, SiN, photoresist and passivation coatingsFilmetrics.

Its motorized precision R-Theta stage supports automatic full-wafer scanning for 4”, 6” and 200mm substrates, generating 2D/3D thickness uniformity contour maps at up to two measurement points per second. Unique production-focused features include automatic wafer notch detection for consistent recipe alignment, on-board auto baselining to eliminate manual calibration downtime, fully enclosed safety chamber with motion interlock, and an industrial-grade pre-configured PC to stabilize long-term factory operation. The system fully supports SECS/GEM communication protocol for seamless MES fab integration, enabling unmanned batch measurement and real-time data uploading.

The bundled FILMapper analysis software comes with a built-in database of over 130 pre-loaded material models, one-click automated measurement recipes, online system diagnostic tools and customizable reporting templates to simplify operator workflows. Optional UV extended wavelength modules expand capability down to 190 nm for ultra-thin gate oxide inspection, while cassette-to-cassette wafer handlers can be integrated for fully lights-out production. This official brochure details complete optical and mechanical parameters, standard calibration reference wafers, upgradeable factory automation accessories and mass-production application solutions for semiconductor deposition, LCD/OLED panel manufacturing, photovoltaic coatings and precision optical films, with one-click PDF download available for production equipment evaluation and process recipe development.