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KLA Profilm3D Optical Profiler Product Brochure

Brief Description ：: Download official product brochure for KLA Filmetrics Profilm3D benchtop optical profiler based on WLI & optional PSI interferometry, delivering sub-nanometer vertical resolution for step height, roughness and 3D topography. It features 100mm auto XY stage, 4-position objective turret, 500μm long piezo travel and TotalFocus full-focus color imaging, with Profilm analysis software for automated mapping and stitching. This brochure includes full hardware specs, optional Profilm3D-200 large-stage version and application cases for MEMS, semiconductors, solar cells, microfluidics and biomedical materials.

File version ：: V1.0.1

File type ：: PDF

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The KLA Filmetrics Profilm3D is an economical benchtop non-contact 3D optical profiling system built around mature white light interferometry (WLI) technology, designed to deliver lab-grade nanoscale surface characterization at a fraction of the cost of high-end industrial optical profilers, eliminating stylus scratching damage on delicate soft films, photoresist and polymer substrates. It supports dual core measurement modes: standard vertical scanning interferometry (WLI) for general roughness and step height testing, plus optional phase-shifting interferometry (PSI) to achieve sub-1 nm vertical resolution for ultra-smooth thin film and nano-pattern inspection.

Two platform variants are available: standard Profilm3D with 100×100 mm automated XY stage, and Profilm3D-200 upgraded to 200×200 mm travel for full-wafer scanning. The system equips a four-position objective turret, ±5° tip-tilt sample stage, industry-leading 500 μm piezo vertical travel and 10× objective delivering a wide 2 mm field of view, paired with proprietary TotalFocus infinite-depth true-color imaging to capture fully focused 3D micrographs without multiple focal stacks. The Enhanced Roughness Mode enables stable measurement of low-reflectivity, steep-slope and heavily textured samples such as solar cell wafers and etched microchannels.

The intuitive Profilm desktop software integrates automated multi-point mapping, seamless image stitching, comprehensive roughness/waviness/step height analysis, film thickness calculation and STL 3D model export functions, with low-cost premium add-ons for batch production workflows. This official brochure details complete mechanical and optical parameters, interchangeable objective lens lineup, vibration isolation accessories and standardized calibration procedures, covering extensive application scenarios including semiconductor lithography etching, MEMS microdevices, photovoltaic textured substrates, microfluidic chips, PCB circuits and biomedical implant coatings, with one-click PDF download for laboratory R&D evaluation and small-batch production quality control.