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KLA Zeta-20 Non-Contact 3D Optical Profiler Product Brochure

Brief Description ：: Download official brochure for KLA Zeta-20 benchtop non-contact optical profiler equipped with patented ZDot multi-mode optical technology, integrating VSI, PSI, DIC and film thickness measurement modules. It delivers 0.1 nm vertical resolution for step height, surface roughness, wafer bow and transparent film characterization, compatible with semiconductors, MEMS, solar cells and optical coatings. This brochure covers full optical specs, interchangeable objectives, automated mapping Zeta3D software and cross-industry application cases for lab R&D and small-volume production QC.

File version ：: V1.0.1

File type ：: PDF

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The KLA Zeta-20 is an all-in-one compact benchtop non-contact 3D optical profiling system built on proprietary ZDot multi-mode optical architecture, designed to eliminate stylus-induced surface damage and deliver comprehensive surface characterization across diverse material surfaces from ultra-smooth thin films to highly rough textured substratesKLA. Integrating six core metrology modes including ZDot simultaneous 3D topography & true-color infinite-focus imaging, vertical scanning interferometry (VSI), phase-shifting interferometry (PSI), Nomarski DIC contrast microscopy and broadband film thickness testing, it supports both transparent and opaque samples with reflectivity ranging below 0.5% up to nearly 100%.

The system achieves industry-leading 0.1 nm vertical resolution and sub-nanometer roughness repeatability, covering step heights spanning angstrom-level ultra-thin layers to millimeter-scale deep microstructures. A motorized high-precision XY stage supports automatic large-area mapping and seamless image stitching, paired with interchangeable 5×, 10×, 20×, 50× and 100× objective lenses to balance field of view and lateral resolution down to 50 nm. Optional piezo Z-stage extends ultra-precise vertical scanning, while dedicated ZFT film thickness module enables 30 nm–100 μm multi-layer transparent film uniformity mapping without additional ellipsometry equipment.

Powered by intuitive Zeta3D analysis software, the platform provides automated feature detection, batch measurement sequencing, comprehensive roughness/waviness/bow calculation and customizable data export workflows. This official brochure details full hardware parameters, vibration isolation fixtures, wafer vacuum chucks and standardized calibration procedures, alongside abundant application solutions for semiconductor etching patterns, MEMS microdevices, LED PSS substrates, photovoltaic textured wafers, magnetic storage media and precision optical coatings. One-click PDF download is available for laboratory process optimization and production quality monitoring.