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KLA Tencor P-7 Benchtop Stylus Profiler Product Brochure

Brief Description ：: Download official product brochure for KLA Tencor P-7 cost-effective benchtop stylus profiler equipped with UltraLite low-force sensor, supporting 150mm seamless long scans without stitching. It delivers sub-angstrom vertical resolution for step height, surface roughness, wafer bow and thin film stress measurement, compatible with silicon wafers, MEMS, photoresist and optical coatings. This brochure covers full hardware specs, interchangeable stylus tips, Apex measurement software workflow and application cases for university labs, material R&D and small-scale production QC.

File version ：: V1.0.1

File type ：: PDF

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The KLA Tencor P-7 is a cost-efficient mid-tier benchtop stylus profiling platform derived from the mature P-17 metrology core, balancing reliable high-precision measurement and competitive price-to-performance ratio for academic laboratories, material research and low-volume manufacturing lines. Adopting the proprietary UltraLite inductive displacement sensor with adjustable constant contact force ranging from 0.03 mg to 50 mg, it prevents surface scratches on delicate soft films such as photoresist and polymer coatings while offering sub-angstrom vertical resolution and outstanding repeatability below 0.4 nm.

The fully motorized X-Y-θ stage supports continuous 150 mm full-diameter sample scanning without stitching, covering vertical topography range from several nanometers up to 1000 μm to quantify step height, micro roughness, surface waviness, wafer curvature and thin film intrinsic stress. Built-in arc motion correction eliminates stylus trajectory deviation errors, paired with a 5MP high-resolution color vision camera for fast target alignment and real-time stylus observation during measurement runs. A full lineup of interchangeable stylus tips from sub-micron to 25 μm radius is available to match diverse feature sizes and film hardness.

The bundled Apex analysis software features intuitive point-and-click operation, automated batch sequencing, pattern recognition and optional SECS/GEM factory communication protocol for fab integration, equipped with multi-dimensional filtering, surface fitting and customizable report generation tools. This official brochure details complete mechanical parameters, optional vacuum chucks and heating fixtures, standardized calibration procedures, and extensive application solutions covering semiconductor lithography & etching, MEMS microstructures, solar substrates, data storage media and optical anti-reflection coatings, with one-click PDF download available for equipment evaluation and process optimization.