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KLA P-170 Stylus Profiler Product Brochure

Brief Description ：: Download official brochure for KLA Tencor P-170 fully automatic cassette-to-cassette stylus profiler, integrating proven P-17 metrology performance and HRP handler. It delivers 2D/3D measurement of step height, surface roughness, wafer bow and thin film stress with seamless full 200mm wafer scanning without stitching, covering nanometer to 1000μm vertical range. Equipped with UltraLite low-force sensor, pattern recognition and SECS/GEM factory communication, this brochure contains full hardware specs, probe options, operation workflow and mass production application cases for silicon, SiC, sapphire and compound semiconductor manufacturing.

File version ：: V1.0.1

File type ：: PDF

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The KLA Tencor P-170 is a fully automatic production-grade stylus profiling system that combines the high-precision measurement core of the benchtop P-17 and the stable HRP®-260 cassette wafer handler, designed for 24/7 high-volume semiconductor and compound semiconductor manufacturing linesKLA. It supports fully unmanned cassette-to-cassette loading for 75–200mm opaque silicon wafers and transparent substrates including sapphire, SiC and GaAs, with automatic pre-alignment and wafer ID reading to streamline fab workflow.

Powered by the proprietary UltraLite® inductive displacement sensor with adjustable constant force control ranging from 0.03 mg to 50 mg, the system avoids surface scratching on delicate soft films while capturing vertical topography ranging from several nanometers up to 1 mm. It enables continuous full-wafer scanning without image stitching, generating 2D line profiles and 3D surface contour maps for step height, micro roughness, wafer bow and film stress analysis. Built-in arc motion correction eliminates stylus trajectory errors, paired with a 5MP high-resolution color vision system and advanced pattern recognition algorithms for accurate feature targeting across patterned wafers.

The intuitive production software supports batch measurement sequencing, cross-system recipe portability and standard SECS/GEM fab communication protocol for MES integration. This official brochure details complete mechanical and optical parameters, interchangeable stylus tip selections, automatic calibration procedures and multi-process application solutions covering lithography, etching, thin film deposition, CMP and backside grinding processes, serving quality monitoring for power devices, LED substrates and RF compound semiconductors with downloadable PDF documentation for process optimization and equipment evaluation.