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The KLA Filmetrics R54 is a next-generation high-precision automated sheet resistance & thin-film resistivity mapping system, integrating contact four-point probe (4PP) and non-contact eddy current (EC) dual measurement modes, realizing electrical characterization for ultra-thin metal films, doped semiconductors, thick conductive coatings and flexible substrates on one single platform.
Two configurations available: R54-200 for 200mm wafers and R54-300 for 300mm wafers, equipped with fully automatic X-Y-θ precision stage, supporting rectangular, linear and polar custom pattern scans to auto-generate 2D & 3D sheet resistance uniformity contour maps. The light-tight closed enclosure protects light-sensitive implant & epi wafers from ambient light interferenceKLA.
Key performance: 4PP mode covers 1mΩ/sq ~ 200MΩ/sq with repeatability <0.01%; non-contact EC mode avoids surface scratch, ideal for photoresist-covered wafers, fine-pitch RDL and flexible electronics, measuring range 1mΩ/sq ~ 50Ω/sq. All measurement results are traceable to NIST resistance standards for compliant semiconductor manufacturing QCKLA.
This official PDF manual includes full machine dimensions, complete probe selection guide, auto height compensation for EC sensor, step-by-step operation of dedicated RsMapper mapping software, edge-effect correction algorithm and standard calibration procedures. Application cases cover semiconductor ion implant annealing, epitaxial silicon, sputtered metal layers, Fan-out wafer level packaging RDL, TOPCon solar cells, FPD conductive coatings and flexible electronics for R&D & mass production, with one-click PDF download available.