In high-end manufacturing fields such as semiconductor manufacturing, new material research and development, and precision optical processing, the surface morphology of materials directly determines the final performance of the products. Whether it is the step height at the micrometer level or the surface roughness at the nanometer level, a high-precision profilometer is needed for "diagnosis". Among numerous measuring devices, the KLA profilometer has become a trusted partner in many R&D and production lines due to its outstanding performance. So, in what aspects exactly do its advantages lie? Today, let's take a closer look at it.
According to official parameters, in the PSI measurement mode, its RMS (root mean square) repeatability can reach 0.1nm, which is at the sub-nanometer level. This means that it can distinguish microstructures that are tens of thousands of times smaller than the diameter of a human hair. For engineers who need to study ultra-smooth optical surfaces, MEMS micro-electromechanical systems or the stress of semiconductor films, such precision provides strong support for obtaining real and reliable surface data, helping them better analyze and optimize processes.
The KLA profilometer adopts a non-contact measurement method based on the principle of white light interference. The light emitted by the light source passes through the beam splitter and then shines on the sample surface and the reference mirror respectively. The surface morphology of the sample is restored by analyzing the interference fringes formed by the reflected light of the two. This method physically eliminates the direct contact between the probe and the sample, achieving non-destructive testing. This advantage is particularly important when measuring photoresist patterns on semiconductor wafers, hardened coatings on mobile phone screens, or biomedical samples, as it can truly restore the original state of the samples.
One notable advantage of Profilm3D lies in its optical system. With only a 10x objective lens, it can provide a field of view of up to 2mm, which makes the search for the target measurement area more efficient. Meanwhile, the device is equipped with a 4-hole objective lens turntable and a maximum 4x optical zoom function. Users can easily switch between objective lenses of different magnifications or adjust the observation fineness through zooming without having to purchase multiple sets of equipment for different fields of view. This flexibility reduces the user's overall procurement cost to a certain extent, enabling one device to adapt to more application scenarios.
The software can present measurement results in an intuitive 2D or 3D form. Users can easily rotate and scale the model, and inspect the texture, defects or waviness of the sample surface from different angles. For applications that require large-scale analysis, the image stitching function can also be obtained through software upgrades, combining images from multiple adjacent fields of view to form a complete and high-precision topography map of a larger area. This is very helpful for analyzing wafer warpage or the surface shape of large-sized optical components.
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