The precision requirements of semiconductor manufacturing processes have been advanced to the nanometer level, and small defects, step height deviations, and roughness anomalies on the wafer surface can directly affect the electrical performance and final yield of chips. As the core equipment for non-contact surface morphology detection, optical profilometer can accurately capture the three-dimensional surface features of semiconductor wafers and devices, becoming an indispensable quality control tool in semiconductor manufacturing and packaging testing. Among them, KLA has launchedOptical profilerWith leading technological indicators and stable performance, it has become the mainstream choice in the industry. However, different models of equipment have differences in functionality and applicable scenarios. How to combine their own production and research and development needs to achieve accurate selection is an important issue faced by many semiconductor companies.
1、 Core performance requirements of optical profilometer for semiconductor surface detection
The testing scenarios in the semiconductor industry have the characteristics of fragile materials, high precision requirements, and large demand for batch testing, which impose strict standards on the performance of optical profilometers. Firstly, non-contact measurement methods must be adopted to avoid scratching sensitive thin film materials such as photoresist and dielectric layers; Secondly, it is necessary to have sub nanometer level vertical resolution, which can identify nanometer level surface undulations and defects; Simultaneously, it is necessary to support a wide range of sample reflectivity and be compatible with various semiconductor materials such as silicon wafers, metal films, polymers, etc; In addition, the automation measurement capability and large-sized sample stage are also key indicators for adapting to batch testing on production lines.
2、 The core technological advantages of KLA Profilm3D optical profilometer
KLA Profilm3D is a widely used 3D white light interferometric optical profilometer in the semiconductor industry, and its core technological advantages fully match the core requirements of semiconductor surface detection. The device adopts a dual technology route of vertical interference scanning (WLI) and phase interference (PSI), with a vertical resolution of sub nanometer level (<1nm), RMS repeatability of 0.1nm in PSI mode and 1.0nm in WLI mode, and a step height accuracy of 0.7% and 0.1%. It can accurately identify nanoscale scratches, particle defects, and step height changes on the wafer surface.
In terms of detection efficiency and flexibility, the Profilm3D optical profiler's 10x objective lens can provide a 2mm field of view, coupled with 4x optical zoom function, which can meet the detection needs of different scales without frequent switching of objectives, effectively reducing the procurement cost of enterprises. The equipment comes standard with a 100mm automatic XY sample stage and a 4-hole objective lens turntable, supporting preset measurement points and automated batch testing. The measurement results can generate 2D/3D morphology distribution maps, making it easy for engineers to quickly analyze data. At the same time, the device supports sample measurement within the reflectivity range of 0.05% -100%, covering the testing needs of the vast majority of materials in the semiconductor industry.
3、 Matching optical profilometer functions with application scenarios
There are significant differences in the measurement requirements of optical profilometers in different semiconductor process stages, and targeted matching of equipment functions is necessary when selecting. In the process of silicon wafer manufacturing, the main focus is on detecting the roughness and flatness of the wafer surface, with a particular emphasis on the repeatability of equipment roughness measurement and the ability to capture large field of view images; In the wafer level packaging process, it is necessary to measure the height, coplanarity, and pad morphology of bumps, and the 3D modeling and batch automatic measurement functions of optical profilometers are particularly important; In the manufacturing of MEMS microelectromechanical systems, it is necessary to detect the size and morphology of complex three-dimensional structures, and it is necessary to choose models that support measurement over a large height range. The WLI mode measurement range of the Profilm3D optical profiler can reach 50nm-10mm, which can meet such requirements.
In the process of serving semiconductor customers, Unicon has provided customized testing solutions based on KLA optical profilometer for multiple wafer manufacturing and packaging companies, optimizing measurement parameters for pain points in different process stages, and helping customers increase the surface defect detection rate to over 99%.
4、 Selection of supporting services and localization support considerations
As a high-precision detection equipment, the long-term stable operation of optical profilometers relies on professional technical support and after-sales service. When selecting, in addition to focusing on the performance parameters of the equipment itself, it is also necessary to consider the supplier's localization service capabilities. As a company that has been deeply involved in the field of precision measurement for more than ten years, Unicon has branch offices in Shanghai, Dongguan, Tianjin, Chengdu and other places, which can provide customers with 7 × 24-hour online technical support and 8-hour rapid on-site response service.
From free sample testing in the early stage to equipment installation and debugging, operation training, and spare parts supply in the later stage, Younikon has established a standardized service system throughout the entire process to ensure that the optical profiler can be quickly put into production and use. At the same time, the technical team of Nikon has rich experience in semiconductor industry applications, which can solve complex measurement problems for customers and ensure that equipment can achieve maximum efficiency throughout its entire lifecycle.
In summary, the selection of semiconductor surface testing requires comprehensive consideration of the measurement accuracy, functional adaptability, and supporting service capabilities of the equipment. The KLA optical profilometer, with its leading technological performance, can meet the vast majority of surface inspection needs in the semiconductor industry. Choosing a supplier with professional technical capabilities and complete localized services is the key to ensuring the long-term stable operation of the equipment. As a core partner of KLA, Unicon will continue to provide high-quality optical profilometer products and one-stop measurement solutions for semiconductor enterprises, helping the industry improve product yield and technological innovation capabilities.
