In the fields of precision machining such as semiconductor manufacturing, new material research and development, and new displays, surface morphology and dimensional accuracy directly determine the final performance of products, and step height and surface roughness are core quality control indicators that run through the entire production process. Many companies ask a core question when purchasing testing equipment: Can optical profilometer manufacturers measure step height and roughness? The answer is yes, as a professional specializing in precision measurement for more than ten years, UniconContour meter manufacturerNot only can it accurately measure these two basic parameters, but it can also provide an integrated detection solution covering multi-dimensional surface characteristics, adapting to the refined quality control needs of different industrial scenarios.
In addition to core parameters, the KLA full range optical profilometer represented by Younikon can also synchronously obtain multidimensional information such as film thickness, external stress, and surface defects. It adopts non-contact measurement method, which will not cause damage to sensitive materials such as soft polymers and biological samples. It can adapt to various sample shapes such as flat and curved surfaces, meeting the detection needs of complex structures.
In response to the testing needs of large-sized samples such as 12 inch wafers in the semiconductor industry, Unicon, as a professional profilometer manufacturer, can expand the sample table size to 590mm × 550mm or more, support custom measurement point maps, generate 2D/3D thickness and morphology distribution maps, and help enterprises quickly locate process deviations.

Wafer manufacturing process: measurement of step height of dielectric film, characterization of surface roughness of epitaxial layer, and surface flatness detection after chemical mechanical polishing (CMP)
Lithography process: measurement of photoresist pattern contour and line width, re inspection of mask template defects
Advanced packaging: wafer level packaging (WLP) bump height and coplanarity detection, TSV via depth and sidewall morphology analysis
Compound Semiconductor: Measurement of Surface Defects and Stress Distribution in Gallium Nitride/Silicon Carbide Epitaxial Layers
Display panel: LCD cell gap uniformity detection, OLED pixel structure morphology characterization
Flexible Electronics: Analysis of Surface Cracks and Roughness Changes after Flexible Substrate Bending
AR/VR Optics: Surface Texture and Step Height Measurement of Diffraction Optical Waveguides, and Shape Detection of Micro Lens Arrays
Optical components: surface roughness of optical thin films, coating step height, and defect detection
Solar cells: Measurement of surface morphology and roughness of perovskite/silicon-based cell thin films, detection of electrode grid line height and width
Lithium batteries: analysis of surface flatness of positive and negative electrode plates, detection of diaphragm thickness and surface defects, characterization of uniformity of current collector coating
Printed circuit board: PCB/FPC circuit copper thickness and step height measurement, solder pad surface roughness detection
Micro Electro Mechanical Systems (MEMS): Measurement of Three Dimensional Structural Morphology, Cantilever Beam Deflection, and Stress Distribution of MEMS Devices
Magnetic materials: Surface roughness and step height detection of magnetic heads, re inspection of surface defects on magnetic films
Medical devices: measurement of surface roughness and coating step height of cardiac stents, characterization of surface morphology of implantable devices
Biomaterials: Surface structure analysis of tissue engineering scaffolds, uniformity and thickness testing of medical coatings
Materials Science: Research on Surface Morphology and Roughness of New Thin Film Materials, Characterization of Material Mechanical Properties (Stress/Strain)
Nanotechnology: Three dimensional morphology measurement of nanostructures and nanodevices, distribution and size analysis of nanoparticles