Seminar on Advanced Technologies for Film Thickness and Surface Measurement
Overview of the Meeting
On May 22, 2019, in order to promote the demand of the measurement technology industry, Uniconon Technology and the Department of Electronic Engineering of Tsinghua University jointly held an advanced technology seminar on thin film thickness and surface measurement as scheduled in the ROM Building of Tsinghua University.
An expert's wonderful report
This time, experts from Tsinghua University, Peking University and Beijing Institute of Technology were invited as keynote speakers. They respectively shared with us The application of on-line film thickness monitoring in ultra-precision cutting processing, the Research On integrable free electron radiation devices, the research Progresses in 21 'Wafers HVPE System and GaN Single-crystal Youdaoplaceholder0. In addition, several doctors from the equipment supplier KLA-Tencor were invited to give us wonderful sharing speeches. The topics shared are respectively: KLA Profiler products introduction and its applications Advances in Spectral Reflectance Measurement and Cloud-Based 3D Analysis, Nano Indenter G200 and its applications, ZETA Multi-mode optical profiler introduction and applications.
Seminar &" The display complements each other perfectly
At this seminar, in addition to listening to experts' sharing speeches, the invited personnel from universities, research institutes and high-tech enterprises can also observe our company's products on site, have in-depth exchanges on technical applications and conduct on-site sample testing. Among them, there were no shortage of users who showed a strong interest in the product on the spot. Participants said they had gained a lot from this event.
The wonderful moments on the spot
