Unicom will participate in the 2024 Compound Semiconductor Advanced Technology and Application Conference
The 2024 Compound Semiconductor Advanced Technology and Application Conference will be held in Changzhou on October 30-31. Hosted by the National Engineering Research Center for Wide Bandgap Semiconductors, this event invites academic leaders, industry leaders, and R&D managers to engage in in-depth exchanges and cooperation. It is expected that the number of participants will reach 400 to 500. We will strive to achieve continuous breakthroughs in key technologies of materials and devices, promote the development of domestic substitution applications, and jointly build an independent and controllable compound semiconductor industrial chain.
Unicron will sponsor and participate in this conference, looking forward to discussing with you on-site about the application of Unicron equipment in the field of compound semiconductors and contributing to the development of the industry.
This meeting isPaid conference
For more details, you can scan the code to contact the organizer
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Meeting time
October 30th - 31st, 2024
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Exhibition Venue
Hilton Changzhou New Town, Jiangsu Province
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Booth layout
Unicon booth C06
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Exhibited equipment
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F50 Film thickness Measuring instrument | ||
The F50 can achieve maximum straightness very simplyThickness distribution map of the sample film with a diameter of 450 millimeters. The r-θ polar coordinate moving platform is adoptedIt can quickly locate the required test points and obtain the test thickness in real time, approximatelyTest two points per second. | ||
Related applicationsSemiconductor manufacturing (photoresist, oxides/nitrides /SOI, wafer backside grinding); LCD liquid crystal display (polyimide, ITO transparent conductive film); Optical coating (hard coating, anti-reflection layer); MEMS micro-electromechanical systems (photoresist, silicon-based film layers). |
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Profilm3D White Light Interference Optical Profilometer | ||
Profilm3D employs the most advanced vertical interference scanning (WLI) and high-precision phase interference (PSI) technologies. Achieve sub-nanometer surface morphology research with strong cost performance. | ||
Related applicationsRoughness measurement Three-dimensional topography characterization Measurement of step height |
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FS-1 multi-wavelength ellipsometer | ||
The Film Sense FS-1 multi-wavelength ellipsometer adopts a long-life LED light source and a non-moving component ellipsometer detector, enabling reliable film measurement in a compact ellipsometer with simple operation. | ||
Related applicationsSilicon dioxide and nitrides, high dielectric and low dielectric materials, amorphous and polycrystalline materials, silicon films, photoresists.High and low index films, such as SiO2, TiO2, Ta2O5, MgF2.TCO (such as ITO), amorphous silicon thin films, organic thin films (OLED technology), etc |
