- Back |
- Home
- / News
- / Enterprise
- / Seminar on Advanced Technologies for Thin Film Thickness and Surface Measurement
Conference Overview
On May 22, 2019, in order to promote the demand of the measurement technology industry, the Advanced Technology Seminar on Thin Film Thickness and Surface Measurement jointly organized by Unicon Technology and the Department of Electronic Engineering at Tsinghua University was held as scheduled at the ROHM Building of Tsinghua University.
Expert's wonderful report
Experts from Tsinghua University, Peking University, and Beijing Institute of Technology were invited as keynote speakers to share with us the application of On line film thickness monitoring in ultra precision cutting, research on integrated free electron radiation devices The Research Progresses in 21’ Wafers HVPE System and GaN Single-crystal Substrates。 In addition, several doctors from equipment supplier KLA Tencor were invited to give us wonderful presentations. The topics shared are: KLA Profiler products introduction and its applications、Advances in Spectral Reflectance Measurement and Cloud-Based 3D Analysis、Nano Indenter G200 and its applications、ZETA Multi-mode optical profiler introduction and applications。
Seminar& Showcasing complement each other
In addition to listening to expert presentations, personnel from universities, research institutes, and high-tech enterprises invited to attend the seminar can also observe our company's products, have in-depth exchanges on technology applications, and conduct on-site sample testing. Some users expressed strong interest in the product on-site. The participants stated that they have benefited greatly from this event.
Exciting moments on site
WeChat Official
Support
