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Conference Preview | 2024 Semiconductor Advanced Technology Innovation, Development, and Opportunities Conference

2026-06-27 16:45:51 admin

Seize opportunities, unite and move forward. The 2024 Semiconductor Advanced Technology Innovation and Development and Opportunities Conference will be organized and held on May 22-23, 2024 at the Shishan International Convention Center in Suzhou.

This conference will be held simultaneously in the form of two forums: "CHIP China Crystal Chip Seminar" and "Advanced Technology and Application Conference of Compound Semiconductors". The conference includes: semiconductor manufacturing and packaging, compound semiconductor materials and preparation processes, power devices and application technologies. Launch a high-end dialogue on the semiconductor industry to promote information exchange and cooperation among participants.

Li Yang, General Manager of Unicon Technology Co., Ltd., will give a special report at this conference to discuss various measurement technologies in the field of compound semiconductors with you.

five point two two

Venue B - Power Electronic Devices and Applications

16：00

Analysis and Selection of Multiple Measurement Technologies in the Field of Compound Semiconductors - Li Yang

Scan the QR code above to register for the conference

As of May 21st

Please register in advance for the conference

This meeting is a paid conference. Please consult the organizer for details

Exhibition equipment


F50 film thickness measuring instrument
F50 can easily obtain straightThickness distribution map of sample film with a diameter of 450 millimeters. Using an r - θ polar coordinate moving platform,Can quickly locate the required test points and obtain real-time test thickness, approximatelyTest two points per second.
Related applications:Semiconductor manufacturing (photoresist, oxide/nitride/SOI, wafer backside grinding); LCD liquid crystal display (polyimide, ITO transparent conductive film); Optical coating (hard coating, anti reflection layer); MEMS microelectromechanical systems (photoresist, silicon-based film layers).


Profilm3D White Light Interference Optical Profilometer
Profilm3D uses vertical interference scanning (WLI) and high-precision phase interference (PSI) technology. Realize sub nanometer level surface morphology research with strong cost-effectiveness.
Related applications:Roughness measurement; Three dimensional morphology characterization; Step height measurement