KLA P-17 probe-type step gauge

The advantages of the KLA P-17 probe-type step meter include a 200mm scanning platform, which can measure the entire substrate without the need for splicing. The UltraLite sensor assembly combines linear vertical measurement and constant force control, capable of measuring various materials and terrains. The top view and side view optical systems can achieve simple position teaching, pattern recognition, and visualization of probes during the measurement process. The KLA P-17 probe-type step tester combines automation with reliability and is suitable for production applications that do not require wafer processors. These applications include step height, roughness and stress measurements of AlTiC, GaAs, Si, SiC and sapphire wafers for the semiconductor, power device, wireless technology, LED and data storage fields.

  • Name: 探针式台阶仪
  • Brand : KLA
  • Product model : P-17
  • Place of Origin: 美国


KLA P-17 probe-type step gauge



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Product Introduction of KLA P-17 Probe-type Step Gauge:

KLA P-17 probe-type step gaugeIt is a product of the P series probe-type step meter. This system is equipped with a programmable scanning platform and low-noise electronic resolution, enabling high-resolution scanning within a vertical range and covering the entire surface area of the sample.

KLA P-17 probe-type step gaugeIts advantages include a 200mm scanning platform that can measure the entire substrate without the need for splicing. The UltraLite sensor assembly combines linear vertical measurement and constant force control, capable of measuring various materials and terrains. The top view and side view optical systems can achieve simple position teaching, pattern recognition, and visualization of probes during the measurement process.

KLA P-17 probe-type step gaugeCombining automation with reliability, it is suitable for production applications that do not require wafer processors. These applications include step height, roughness and stress measurements of AlTiC, GaAs, Si, SiC and sapphire wafers for the semiconductor, power device, wireless technology, LED and data storage fields.


Product features of KLA P-17 probe-type step gauge:

  • Good repeatability and reproducibility

  • No splicing is required, and the scanning length can reach 200mm

  • Direct and material-independent measurement

  • An application that automatically maintains feature heights.

  • Pattern recognition supports automatic measurement and enhances productivity.

  • Supports for automatic sorting, result reporting and recipes

  • The SecS/GEM requirements for database control



Measurement principle of KLA P-17 probe-type step meter:

KLA P-17 probe-type step gaugeThe LVDC sensor technology is adopted. The LVDC sensor tracks the surface terrain by utilizing changes in capacitance. The capacitance change is caused by the movement of a thin metal sensor blade moving between two capacitive plates. When the probe tracks the surface, the position of the sensor blade changes, which causes a change in capacitance. Then, the capacitance change is converted into a terrain signal. The advantage of LVDC design is its small mass and linear motion of the blades, thereby reducing hysteresis and friction to a very low level. This design enables precise, stable and high-resolution measurements throughout the entire vertical range.


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The main applications of KLA P-17 probe-type step gauge:

High-resolution two-dimensional and three-dimensional scanning of surface topography

Step heights ranging from nanometers to 1mm

The roughness and waviness of smooth and rough textures

Bow shape and radius of curvature

Calculate the stress of the film using the Stoney equation

Defect description and defect review applications are carried out using KLARF files


Application of KLA P-17 probe-type step product:

Step height

Based on the dynamic range of the sensor combination, measure the height of two-dimensional and three-dimensional steps from nanometers to 1mm. Quantify the materials deposited or removed in etching, sputtering, SIMS, deposition, spin coating, CMP and other processes.

Texture: Roughness and waviness

Measure two-dimensional and three-dimensional textures, and simultaneously quantify the roughness and waviness of the sample. The roughness and ripple components are discriminated by using software filters, and parameters such as root mean square roughness are calculated.

Form: Bow and shape

Measure the 2D shape or bow of the surface, including the wafer bow resulting from layer stress mismatch during device manufacturing, such as in the production of semiconductor or composite semiconductor devices with multi-layer deposition. Measure the height and radius of curved surface structures, such as lenses.

Thin film stress

Measure the 2D and 3D stresses caused during the manufacturing process of semiconductor or compound semiconductor devices with multiple process layers. The 2D stress mode uses a single scan across the sample diameter, while the 3D stress mode rotates θ steps between 2D scans to measure the entire sample surface.

Defect detection

Measure the morphology of the defect, such as the depth of the scratch. Import KLARF position coordinates from the defect inspection tool to automatically navigate to specific defects. Use the defect review application to select individual defects for 2D or 3D measurement.


Industry application of KLA P-17 probe-type steps:

Semiconductors and composite semiconductors

Measure the surface topography from the front end to the back end and during the packaging process. These applications include the measurement of photoresist thickness, etching depth, sputtering height, post-CMP morphology, roughness, sample bending and stress. Optimize measurement accuracy by using pattern recognition and automatic analysis to improve production process control.

LED and power supply equipment

Measure the step height of the patterning process, including the MESA step height, ITO step height and contact depth. Measure substrate rolling off, bending, epitaxial roughness and epitaxial film stress that may cause cracks and defects. Use the defect review application to distinguish between nuisance and defect.

MEMS and optical electronics

Measure the step height, radius of curvature and 3D terrain of macroscopic and microscopic lenses. Measure the depth and surface roughness of waveguide and dense wavelength division multiplexing (DWDM) structures.

Data storage

Describe the characteristics of thin-film head chips and sliders, hard disks, optical and magnetic media. Chip applications include electroplating thickness, coil height and CMP flatness. Slider applications include polarity dent analysis, air bearing cavity measurement and laser texture bump characterization, including bump height, width and depth analysis.

General application

Use the KLA P-17 probe-type surface profilometer for production or research and development. For example, measure the safety characteristics of fabrics or roughness related to absorbency. Biomedical examples include the measurement of catheter surface texture and medical stents. Consumer electronics applications include touchscreen topographic measurement or the measurement of film step height on glass screens.



Measurement diagram of KLA P-17 probe-type step meter:

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