KLA P-170 Fully Automatic Probe Surface Proformer

The KLA P170 fully automatic probe based surface profilometer (stair step meter) provided by Unicon Technology is a cassette to cassette automated stair step meter that combines the measurement performance of the P17 desktop system with the HRP260 production validated robotic arm. The measurement range of step height is from nanometer level to 1000 μ m, with a vertical resolution of 0.01&Ring; Step height repeatability 4&Ring; Or 0.1%, constant force control 0.03– 50mg, Scanning range of 200mm does not require splicing. The system can automatically load 75mm to 200mm opaque (such as silicon) and transparent (such as sapphire) samples, achieve fully automatic measurement through graphic recognition, sorting, and feature detection, and support SECS/GEM communication protocol. A single scan can simultaneously analyze up to 30 steps of parameters such as step height, surface roughness, CMP analysis, etc. Suitable for high-throughput automated production environments in industries such as semiconductors, compound semiconductors, LEDs, MEMS, and data storage. Younikon Technology provides professional technical support.

  • Name 全自动探针式表面轮廓仪
  • Brand KLA
  • Model P-170
  • Origin 美国


KLA P-170 Fully Automatic Probe Surface Proformer



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The KLA P170 fully automatic probe based surface profilometer (stair step meter) provided by Unicon Technology is a cassette to cassette automated stair step meter that combines the measurement performance of the P17 desktop system with the HRP260 production validated robotic arm. The measurement range of step height is from nanometer level to 1000 μ m, with a vertical resolution of 0.01 Å and a step height repeatability of 4 Å or 0.1%. The constant force control is 0.03-50mg, and the scanning range is 200mm without splicing. The system can automatically load 75mm to 200mm opaque (such as silicon) and transparent (such as sapphire) samples, achieve fully automatic measurement through graphic recognition, sorting, and feature detection, and support SECS/GEM communication protocol. A single scan can simultaneously analyze up to 30 steps of parameters such as step height, surface roughness, CMP analysis, etc. Suitable for high-throughput automated production environments in industries such as semiconductors, compound semiconductors, LEDs, MEMS, and data storage. Younikon Technology provides professional technical support.


KLA P-170 Fully Automatic Probe Surface Proformer Product Introduction:

KLA P-170 Fully Automatic Probe Surface ProformerA box to box step meter withKLA P-17 probe based surface profilometerThe performance measurement of the desktop system and the production validated processing program of the HRP260 system. The system provides a programmable scanning platform, low noise, and full vertical range of Anangren electronic resolution, allowing for high-resolution scanning anywhere on the sample surface.

The formula setting of the KLA P-170 system is fast and simple, with point and click platform control, dual view optics, and high-resolution digital cameras. Place the cursor on a specific feature to achieve fully automated measurement through automatic wafer processing, pattern recognition, sorting, and feature detection.KLA P-170 Fully Automatic Probe Surface ProformerIncluding automatic data analysis, up to 30 steps of step height, surface roughness, histogram step height, CMP analysis in a single scan, as well as a set of extended analysis algorithms using Apex advanced data analysis software. Advanced geometric recognition algorithms and calibration of X-Y and Z-axis matching enhance the transportability of formulas between systems, which is a key requirement for 24x7 production environments.


KLA P-170 Fully Automatic Probe Surface Proformer Product Features:

  • Step height: several nanometers to 1000 μ m

  • Micro force constant force control: 0.03 to 50mg

  • Sample full diameter scanning, no need for image stitching

  • Video: 5-megapixel high-resolution color camera

  • Arc correction: Clearing errors caused by the arc motion of the probe

  • Production capacity: Fully automated through sequencing, pattern recognition, and SECS/GEM

  • Wafer mechanical transfer arm: automatically loads 75mm to 200mm opaque (such as silicon) and transparent (such as sapphire) samples


Measurement principle of KLA P-170 fully automatic probe based surface profilometer:

KLA P-7 probe step meterAdopting LVDC sensor technology, LVDC sensors use changes in capacitance to track surface terrain. The capacitance change is caused by the movement of thin metal sensor blades moving between two capacitor plates. When the probe tracks the surface, the position of the sensor blade changes, resulting in a change in capacitance, which is then converted into terrain signals. The advantage of LVDC design is its small mass and linear blade movement, which reduces hysteresis and friction to a very low level. This design enables precise, stable, and high-resolution measurements throughout the entire vertical range.


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The main applications of the KLA P-170 fully automatic probe based surface profiler are:

Fully automatic industrial measurement

Thin film/thick film step and etching depth measurement

Photoresist/photoresist step

Flexible film

Surface roughness/flatness characterization

Surface curvature analysis

2D/3D stress measurement of thin films

Surface 3D contour imaging and structural analysis

Defect characterization and analysis

Roll off measurement

Other surface analysis functions


KLA P-170 Fully Automatic Probe Surface Proformer Product Application:

step height

Measure two-dimensional and three-dimensional step heights ranging from nanometers to 1mm based on the dynamic range of sensor combinations. Quantification in etching, sputtering SIMS、 Materials deposited or removed during deposition, spin coating, CMP, and other processes.

Texture: roughness and waviness

Measure two-dimensional and three-dimensional textures, while quantifying the roughness and waviness of the sample. Use software filters to distinguish between roughness and ripple components, and calculate parameters such as root mean square roughness.

Form: Bow and Shape

Measure the 2D shape or bow of the surface, including wafer bows generated during device manufacturing due to layer stress mismatch, such as multi-layer deposition in the production of semiconductor or composite semiconductor devices. Measure the height and radius of curved structures, such as lenses.

Thin film stress

Measure the 2D and 3D stresses induced during the manufacturing process of semiconductor or compound semiconductor devices with multiple process layers. The 2D stress mode uses a single scan across the diameter of the sample, while the 3D stress mode rotates θ levels between 2D scans to measure the entire sample surface.

defect detection

Measure the terrain of defects, such as the depth of scratches. Import KLARF position coordinates from the defect inspection tool and automatically navigate to specific defects. Use defect review procedures to select individual defects for two-dimensional or three-dimensional measurement.


KLA P-170 Fully Automatic Probe Surface Proformer Industry Applications:

Semiconductors and Composite Semiconductors

Measure the surface morphology of the front-end to back-end and packaging process. These applications include the measurement of photoresist thickness, etching depth, sputtering height, CMP morphology, roughness, sample bending, and stress. Use pattern recognition and automatic analysis to optimize measurement accuracy and improve production process control.

LED and power devices

Measure the step height of the patterned process, including MESA step height, ITO step height, and contact depth. Measure substrate rolling, bending, epitaxial roughness, and epitaxial film stress that may cause cracks and defects. Use defect review applications to distinguish between nuisance or fatal defects.

MEMS and Optoelectronics

Measure the step height, curvature radius, and 3D terrain of macro and micro lenses. Measure the depth and surface roughness of waveguides and dense wavelength division multiplexing (DWDM) structures.

data storage

Describe the characteristics of thin film head chips and sliders, hard drives, optical and magnetic media. Chip applications include plating thickness, coil height, and CMP flatness. Sliding block applications include polarity indentation analysis, air bearing cavity measurement, and laser textured bump characterization, including bump height, width, and depth analysis.

5G applications

Measure the topography and step height of various devices after etching, before CMP, and after CMP. Utilizing the production function of the KLA P-170 fully automatic probe based surface profiler, multiple parts on the wafer are automatically measured to increase quality control of critical layers and improve device reliability.


Hardware features of KLA P-170 fully automatic probe based surface profiler:

Probe options

KLA P-170 Fully Automatic Probe Surface ProformerProvide various probes that support measuring step height, aspect ratio step size, roughness, sample bow shape, and stress. The range of probe radius is 40nm to 50 μ m, which determines the lateral resolution of the measurement. The angles included range from 20 to 100 degrees, determining the maximum aspect ratio of the measured features. All probes are made of diamond to reduce probe wear and extend probe life.

Sample chuck

The KLA P-170 stair step gauge system has a range of chucks to choose from to support multiple applications. The standard is a vacuum chuck that supports measuring samples from 75 to 200 millimeters. The stress clamp has a 3-point locator, which supports accurate bow measurement of the sample in the neutral position. There are also options for processing bow shaped wafer samples.

Processing program options

The KLA P-170 stair step system includes an aligner for opaque wafers (such as GaAs) and a box workstation for 200mm wafers. The options include a transparent sample aligner (such as sapphire), smaller sample sizes ranging from 75mm to 150mm, a second box station, box slot mapper, signal tower, and ionizer.

Isolation platform

The KLA P-170 stair step gauge system is equipped with an independent isolation platform that uses air isolators to provide passive isolation. This customized isolation platform meets the ergonomic requirements of SEMIS8, placing the keyboard, mouse, monitor, and a box type workstation at the correct ergonomic height. The keyboard, mouse, computer, and monitor are on a separate component to isolate noise during measurement by the KLA P-170 stair step system.

Step height standard

The KLA P-170 stair step system uses NIST traceable step height standards for thin and thick films provided by VLSI Standards Corporation. These standards have oxide steps installed on silicon wafers on quartz blocks, or etched quartz steps with chromium coatings. The available step height standards range from 8 nanometers to 250 micrometers, and wafer mounting standards can also be used with processors.


KLA P-170 Fully Automatic Probe Surface Proformer Product Parameters:

Repeatability:

4Å(0.10%)

Vertical resolution:

0.01A

Maximum measurement length:

200mm

Needle pressure range:

0.03~50mg

Horizontal resolution (X):

0.025µm

Horizontal resolution (Y):

0.5µm

Scanning speed:

2µm/s-25mm/s

Vertical linearity:

±0.5%>2000Å10Å≤2000Å

More parameters can be obtained by contacting us


Measurement diagram of KLA P-170 fully automatic probe type surface profilometer:

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