KLA P-17 probe step meter
The KLA P17 probe based surface profilometer (stage instrument) provided by Unicon Technology is the eighth generation desktop probe profilometer, which has accumulated over 40 years of surface measurement experience. The measurement range of step height is from nanometer level to 1000 μ m, with constant force control of 0.03-50mg. The scanning range can reach 200mm without image stitching. UltraLite ® The combination of sensors and ultra flat scanning sample stage achieves excellent measurement stability, equipped with a 5-megapixel high-resolution color camera and optical zoom function. The system supports 2D and 3D measurement of step height, roughness, curvature, and stress, with fully automatic measurement functions for graphic recognition, sorting, and feature detection, and supports SECS/GEM communication protocol. Suitable for semiconductors and compound semiconductors LED、 Solar energy MEMS、 The research and production processes in industries such as data storage, automotive, and medical equipment. Younikon Technology provides professional technical support.
Product Introduction of KLA P-17 Probe Step Gauge:
KLA P-17 probe step meterIt is a product of the P series probe type stair step meter. The system has a programmable scanning platform, low noise electronic resolution, and can achieve high-resolution scanning within a vertical range, covering the entire surface area of the sample.
KLA P-17 probe step meterThe advantages include a 200mm scanning platform that can measure the entire substrate without the need for splicing. The UltraLite sensor component combines linear vertical measurement and constant force control to measure various materials and terrains. The top and side view optical systems can achieve simple position teaching, pattern recognition, and visualization of probes during the measurement process.
KLA P-17 probe step meterCombining automation with reliability, suitable for production applications that do not require wafer processors. These applications include step height, roughness, and stress measurement of AlTiC, GaAs, Si, SiC, and sapphire wafers used in semiconductor, power device, wireless technology, LED, and data storage fields.
Product features of KLA P-17 probe step meter:
Good repeatability and reproducibility
No need for splicing, scanning length can reach 200mm
Direct and material independent measurement
An application that automatically maintains feature height.
Pattern recognition supports automatic measurement and improves productivity.
Support for automatic sorting, result reporting, and formulation
SecS/GEM requirements for database control
Measurement principle of KLA P-17 probe step meter:
KLA P-17 probe step meterAdopting LVDC sensor technology, LVDC sensors use changes in capacitance to track surface terrain. The capacitance change is caused by the movement of thin metal sensor blades moving between two capacitor plates. When the probe tracks the surface, the position of the sensor blade changes, resulting in a change in capacitance, which is then converted into terrain signals. The advantage of LVDC design is its small mass and linear blade movement, which reduces hysteresis and friction to a very low level. This design enables precise, stable, and high-resolution measurements throughout the entire vertical range.
The main applications of KLA P-17 probe type stair step meter are:
High resolution 2D and 3D scanning of surface morphology | Step height from nanometer to 1mm |
The roughness and waviness of smooth and rough textures | Bow shape and curvature radius |
Calculate the stress of thin films using the Stoney equation | Application of defect description and defect review using KLARF files |
KLA P-17 probe type step product application:
step height
Measure two-dimensional and three-dimensional step heights ranging from nanometers to 1mm based on the dynamic range of sensor combinations. Quantification in etching, sputtering SIMS、 Materials deposited or removed during deposition, spin coating, CMP, and other processes.
Texture: roughness and waviness
Measure two-dimensional and three-dimensional textures, while quantifying the roughness and waviness of the sample. Use software filters to distinguish between roughness and ripple components, and calculate parameters such as root mean square roughness.
Form: Bow and Shape
Measure the 2D shape or bow of the surface, including wafer bows generated during device manufacturing due to layer stress mismatch, such as multi-layer deposition in the production of semiconductor or composite semiconductor devices. Measure the height and radius of curved structures, such as lenses.
Thin film stress
Measure the 2D and 3D stresses induced during the manufacturing process of semiconductor or compound semiconductor devices with multiple process layers. The 2D stress mode uses a single scan across the diameter of the sample, while the 3D stress mode rotates θ levels between 2D scans to measure the entire sample surface.
defect detection
Measure the morphology of defects, such as the depth of scratches. Import KLARF position coordinates from defect inspection tool for automatic navigation to specific defects. Use defect review applications to select individual defects for 2D or 3D measurement.
KLA P-17 probe type step industry application:
Semiconductors and Composite Semiconductors
Measure the surface morphology of the front-end to back-end and packaging process. These applications include the measurement of photoresist thickness, etching depth, sputtering height, CMP morphology, roughness, sample bending, and stress. Use pattern recognition and automatic analysis to optimize measurement accuracy and improve production process control.
LED and power equipment
Measure the step height of the patterned process, including MESA step height, ITO step height, and contact depth. Measure substrate rolling, bending, epitaxial roughness, and epitaxial film stress that may cause cracks and defects. Use defect review applications to distinguish between nuisances or defects.
MEMS and Optical Electronics
Measure the step height, curvature radius, and 3D terrain of macro and micro lenses. Measure the depth and surface roughness of waveguides and dense wavelength division multiplexing (DWDM) structures.
data storage
Describe the characteristics of thin film head chips and sliders, hard drives, optical and magnetic media. Chip applications include plating thickness, coil height, and CMP flatness. Sliding block applications include polarity indentation analysis, air bearing cavity measurement, and laser textured bump characterization, including bump height, width, and depth analysis.
General application
Use KLA P-17 probe based surface profilometer for production or research and development. For example, measuring fabric safety characteristics or roughness related to absorbency. Biomedical examples include surface texture of catheters, measurement of medical stents, and consumer electronics applications such as touch screen terrain measurement or height measurement of thin film steps on glass screens.
Measurement diagram of KLA P-17 probe step meter:
