KLA D600 Probe Surface Proformer

Contact step meter | Optical lever sensor | Sub angstrom resolution | Nano to millimeter step measurement

KLA D600探针式表面轮廓仪

zero point three eightÅ

vertical resolution

5Å

Repeatability of step height

one thousand and two hundredμm

Z-direction scanning range

zero point zero threemg

Minimum probe force

D600 It is a product that adoptsOptical lever sensorThe contact step meter provides sub angstrom vertical resolution and a measurement range of up to 1200 μ m for step height. measurement resultsUnrelated to material properties——Whether it is transparent or opaque, high reflection or low reflection materials, they can be directly and accurately measured. Equipped with a 200mm electric sample stage, a 5-megapixel color camera, and 0.03-15mg adjustable micro force control, it is an ideal tool for process monitoring in the fields of semiconductor, LED, MEMS, and materials science.

五大核心优势

high precision

Ayer resolution

The optical lever sensor provides a vertical resolution of 0.38 Å and a step height repeatability of 5 Å, making it easy to meet the measurement needs of nanoscale thin film steps.

universal

Material independence

Direct contact measurement is independent of the optical properties of the material. Transparent, opaque, highly reflective, or low reflective materials can all directly obtain accurate results.

Micro force

Micro force controllable

The probe force can be adjusted from 0.03-15mg, ensuring safe measurement even for the most fragile photoresists, polymers, or biological coatings without damaging the surface.

multidimensional

2D/3D full functionality

Supports 2D contour scanning and 3D morphology imaging, while providing measurements of roughness, waviness, warpage, and film stress (Stoney equation).

convenient

Plug and Play

Compact size and intuitive operation. The 5-megapixel color camera accurately locates the measurement area and can be quickly used with simple training.

典型应用领域

Semiconductor front-end/back-end processLED & Compound semiconductorsolar cellMEMS Micro Electro Mechanical Systemsmedical equipmentAutomotive EngineeringUniversities and colleges; Research institutionsMaterials Science Laboratory

六项核心测量功能

Step height measurementAccurate measurement of step height from nanometer level to 1200 μ m, suitable for quantitative analysis of material removal or addition in processes such as etching, sputtering, deposition, spin coating, CMP, etc.

2D surface contour scanningSingle line scanning to obtain the surface height variation curve of the sample, with a lateral resolution of 0.1 μ m and a maximum scanning length of 30mm, for rapid evaluation of process uniformity.

3D Shape ImagingMultiple parallel scanning lines are used to synthesize a three-dimensional surface morphology map, with a lateral resolution of 1 μ m and a maximum scanning area of 55mm × 120mm, presenting surface features intuitively.

Roughness& wavinessAnalysis of line roughness and surface roughness parameters that comply with international standards, quantifying surface texture features, and meeting the requirements of process monitoring and quality control.

Warping degree& radius of curvatureMeasure the overall warpage and curvature radius of the sample, calculate the residual stress of the thin film using the Stoney equation, and optimize the deposition process parameters of the thin film.

Thin film stress measurementBased on the Stoney equation, accurate calculation of film stress is achieved by measuring the curvature changes of the substrate before and after film deposition, which is widely used in the semiconductor and optical coating industries.

Measuring principle

Optical lever sensing technologyIt is the core of D600. When the probe scans along the surface of the sample, the laser beam above the axis component is deflected due to surface undulations. The deflected beam is divided into two paths and projected onto the photodetector - one path is used for high-resolution measurement of small steps, and the other path is used for measurement of large steps. The laser beam deflection is converted into a height signal in real-time.

Core advantage: The sensor components are lightweight and can achieve0.03mg ultra-low force measurementFast response speed and precise tracking of surface morphology changes.

接触式台阶仪 vs 光学轮廓仪

comparative dimension	D600 probe profilometer	Optical profilometer (white light interferometry)
测量原理	Contact type - diamond probe scanning	Non contact - White Light Interference Optical Imaging
Material applicability	Unrelated to the optical properties of the material, fully applicable	Dependent on surface reflectivity, low reflective materials are limited
Step height range	Nano scale to 1200 μ m	Nano to millimeter scale
vertical resolution	0.38Å	Sub nanometer scale (PSI mode)
measurement dimension	2D line scan+3D surface scan	3D surface scanning
Typical advantages	Material independent, high step, low cost	Non contact, non damaging, fast speed

产品参数

vertical resolution	0.38Å	Repeatability of step height	5 Å or 0.1% (whichever is greater)
Z-direction scanning range	1200μm	Probe force range	0.03-15mg (adjustable)
2D maximum scanning length	30mm (resolution 0.1 μ m)	3D maximum scanning area	55mm × 120mm (resolution 1 μ m)
scanning speed	10 – 400μm/s	sampling rate	60 – 2000Hz
XY sample stage (automatic)	150mm × 178mm	Theta rotary table (manual)	360°
Sample table diameter	80mm / 20mm	Maximum sample thickness	30mm
camera	5-megapixel high-resolution color camera	Sensor Technology	光学杠杆传感器
certification	Compliant with CE standards

实测数据展示

Frequently Asked Questions

What is the difference between D600 and optical profilometer (such as Profilm3D)?

D600 is a contact step meter that uses a diamond probe to scan the surface of the sample; Optical profilometer is a non-contact white light interferometry imaging. Core difference: The D600 measurement results are not related to the optical properties of the material, and transparent, opaque, highly reflective, and low reflective materials can all be directly measured; D600 is particularly suitable for measuring high steps (up to 1200 μ m), and optical profilometers may be limited by depth of field at large steps; The optical profiler can quickly obtain large-area 3D morphology, and the D600 is suitable for high-precision single line step measurement. The two complement each other in practical applications.

Will the D600 probe scratch my sample?

The probe force of D600 can be flexibly adjusted within the range of 0.03-15mg. For soft materials such as photoresist, polymers, and biological coatings, choosing an ultra-low force setting of 0.03-1mg can safely measure without producing visible scratches. For hard materials such as metals and ceramics, using higher force can obtain more stable measurement signals. The probe tip radius also has multiple specifications to choose from, which can be flexibly matched according to the sample type.

What parameters can D600 measure?

D600 supports the following core measurement functions: step height (nanometer to 1200 μ m); 2D surface contour and 3D morphology imaging; Line roughness and surface roughness parameters (Ra, Rq, Rz, etc.); Ripple analysis; Sample warpage and curvature radius; Thin film stress calculation based on Stoney equation. One device covers all surface profile measurement requirements from process monitoring to failure analysis.

What are the advantages of D600's optical lever sensor?

The optical lever sensor is the core technology that distinguishes D600 from traditional step meters. It uses the reflection of the laser beam on the surface of the rotating shaft component to track the vertical displacement of the probe. The entire sensor component has a very small mass, so it can achieve ultra-low probe force measurement of 0.03mg. Simultaneously, it has fast response speed and can accurately track rapid changes in surface morphology. The dual detector design - one for small step high-resolution measurement and the other for large step measurement - balances high precision and wide dynamic range.

What industries and applications is D600 suitable for?

D600 is widely used in semiconductor wafer manufacturing (photoresist thickness, etching depth, CMP process monitoring), LED and compound semiconductors, MEMS microelectromechanical systems, solar cells, automotive engineering, medical equipment coatings, and materials science research in universities. It is particularly suitable for process steps that require precise quantification of material addition or removal, and is also commonly used for SIMS indentation depth measurement and thin film stress analysis.

Free sample testing service

Free Sample Testing Service

Not sure if your sample is suitable for D600 probe profilometer measurement? We offer free sample testing services! Send us samples, and our professional engineers will conduct step height, roughness, or stress tests for you, and provide detailed measurement reports and solution recommendations.