KLA G200X Nanoindentation Tester
Flagship Nanomechanics Testing Platform - Load Range 1 μ N~10N, Covering Six Quantity Deformation Measurements, Optional SPM Scanning Imaging
1μN～10N Load range (expandable) | ＞500μm Maximum indentation depth | ＜0.01nm Displacement resolution | 100kHz Data collection rate |
产品介绍
KLA G200X Nanoindentation TesterIt is the flagship platform in the KLA nanomechanical testing product line, using an electromagnetic driven XP indentation head with a displacement resolution of better than 0.01nm, a maximum indentation depth of over 500 μ m, and a load range that can be extended to 10N, covering deformation measurements in six orders of magnitude from nanometers to millimeters. G200X is a recognized benchmark system for nanoindentation in the industry, serving top research institutions and semiconductor companies worldwide with outstanding accuracy, stability, and scalability.
The G200X adopts a fully modular design, supporting advanced functions such as nanoindentation, scratch testing, continuous stiffness measurement (CSM), SPM scanning probe imaging, high-temperature nanoindentation, rapid indentation, etc., in compliance with the ISO 14577 international standard. The optional NanoVision scanning probe microscope option enables high-resolution 3D scanning imaging of the sample surface before and after nanoindentation testing, accurately locating the test area and characterizing indentation morphology and crack length - a key capability for fracture toughness assessment. The system supports wide dynamic range testing from 1 μ N ultra-low load (suitable for soft materials and biological samples) to 10N high load (suitable for metals and ceramics), making it a truly versatile nanoindentation instrument.
Flagship positioningKLA G200X It is a flagship testing platform in the field of nanoindentation. Its XP electromagnetic pressure head system, sub nanometer displacement resolution, and up to 10N extended load capacity make it a benchmark for nanomechanical characterization covering everything from ultra soft biomaterials to ultra hard engineering ceramics. The SPM scanning probe imaging and fracture toughness assessment functions are the core differentiating advantages of G200X compared to desktop systems such as iNano.
Why choose G200X? ——Six flagship level core advantages
XP Electromagnetic Pressure Head · Measurement of Six Scale DeformationThe G200X adopts KLA's patented XP electromagnetic driven indentation head, with a load range from 1 μ N to 1N (expandable to 10N), a maximum indentation depth of over 500 μ m, and deformation measurement covering six orders of magnitude from nanometers to millimeters. Whether it is micro indentation of ultra soft gel or heavy load test of hard metal, a G200X can complete full range characterization.
SPM scanning probe imaging and 3D visualization of indentation morphologyThe optional NanoVision scanning probe microscope (SPM) module can use a pressure head as a probe to perform high-resolution 3D scanning imaging of the sample surface, with a positioning accuracy of 1nm step size and a scanning range of 100 μ m × 100 μ m (optional 500 μ m × 500 μ m). Scanning before and after testing can accurately characterize the residual morphology of indentation and crack length, and is an indispensable tool for fracture toughness assessment and failure analysis.
CSM Continuous Stiffness Measurement · Depth Profile Mechanical AnalysisG200X comes standard with Continuous Stiffness Measurement (CSM) function, which obtains real-time continuous variation curves of hardness and elastic modulus with the depth of pressing during the pressing process. CSM is an irreplaceable depth profile mechanical analysis tool for non-uniform materials such as gradient coatings, multi-layer film interfaces, and ion implantation modified layers. Simultaneously supporting ProbeDM polymer testing to measure the storage modulus, loss modulus, and tan delta of viscoelastic materials.
【 Fully Modular Expansion · Complete Nanomechanics Toolbox 】G200X supports all advanced testing modules: NanoBlitz 3D/4D mechanical property distribution map and tomography, scratch and wear testing (evaluating coating adhesion and wear resistance), high-temperature nanoindentation (up to 800 ° C), fracture toughness assessment (measuring crack length through SPM), interface adhesion measurement, IV electrical testing, etc. The modular design enables the G200X to be flexibly configured according to application requirements, from basic indentation testing to a complete set of nanomechanical analysis.
NanoBlitz High Speed Atlas: Multi point Mechanical Imaging per SecondThe NanoBlitz 3D mode can quickly perform a large number of nanoindentation on the surface of the sample at a rate of one data point per second, automatically generating a color distribution map of mechanical properties, presenting spatial variations of parameters such as hardness and modulus. The NanoBlitz 4D upgrade option supports high strain rate measurement, which can obtain complete three-dimensional distribution information of mechanical properties with depth and position. It is a powerful tool for mechanical characterization of composite materials, weld heat affected zones, and multiphase alloys.
ISO 14577 standard - Production line level reliabilityThe G200X is equipped with pre programmed testing methods that comply with the ISO 14577 international standard, which can automatically measure and report instrument hardness, Vickers hardness, and Young's modulus. The system is stable and reliable, with good data repeatability, and has been used as a standardized nanoindentation testing platform by numerous semiconductor companies and material research institutions worldwide. NanoSuite software provides a wide range of pre programmed testing methods that beginners can quickly get started with.
The difference between G200X and iNano
G200X and iNano are both excellent nanoindentation instruments under KLA, sharing core electromagnetic drive technology, 100kHz high-speed acquisition, and CSM continuous stiffness measurement function. The main difference between the two is thatLoad range, SPM imaging capability, and system positioning：
| comparative dimension | G200X flagship nanoindentation instrument | INano desktop nanoindentation instrument |
|---|
| product positioning | Flagship level all-around nanoindentation testing platform | High performance desktop nanoindentation instrument |
| load range | 1 μ N-10N (six orders of magnitude) | 3nN – 50mN |
| Maximum indentation depth | ＞500μm | 50μm |
| SPM scanning imaging | Optional NanoVision SPM, 100 μ m × 100 μ m scanning | Not applicable (can be upgraded to G200X) |
| Typical Applications | Fracture toughness, high load testing, SPM imaging, high temperature testing | Fast measurement of hardness/modulus, testing of soft materials, QC inspection |
Core testing functions and application scenarios
As a flagship nanoindentation platform, G200X covers a complete testing system from basic hardness modulus measurement to advanced fracture toughness assessment. The following are the core testing functions and application scenarios of G200X:
| 测试功能 | Function Description and Technical Advantages | Typical application scenarios |
|---|
| High speed hardness and modulus measurement | Measure hardness and elastic modulus at a rate of one data point per second. The electromagnetic driven XP indenter covers a load range of 1 μ N-10N and can characterize all material types from ultra soft polymers to hard ceramics. Compliant with ISO 14577 international standard. | Semiconductor thin films, hard coatings, metals/alloys, ceramics/glass, polymers |
| Continuous Stiffness Measurement (CSM) | Real time acquisition of the continuous variation curves of hardness and modulus with depth during the pressing process, without the need for multiple unloading cycles. Combined with the ProbeDM module, the storage modulus, loss modulus, and tan delta of viscoelastic polymers can be measured. | Gradient coating, multi-layer film interface analysis, ion implantation layer, polymer dynamic mechanical analysis |
| Fracture toughness assessment | By inducing cracks through nanoindentation and accurately measuring the indentation angle crack length using NanoVision SPM scanning probe microscope, the fracture toughness (KIC) of the material is calculated based on classical fracture mechanics models. | Ceramics, glass, hard coatings, semiconductor materials, MEMS structural materials |
| Interface adhesion force measurement | Measure the interfacial fracture toughness and adhesion energy of multi-layer thin film systems by inducing thin film delamination through deposition of high compressive stress layers. Understanding the failure modes of thin films and optimizing film design is of crucial importance. | Semiconductor multilayer interconnection, optical coating, hard coating/substrate interface |
| Scratch and Wear Testing | Perform scratch testing on the sample surface with a constant or increasing load to evaluate the adhesion, scratch resistance, and wear resistance of the coating to the substrate. Can simulate mechanical stress in processes such as CMP and wire bonding. | Hard coating adhesion, automotive coatings, optical coatings, electronic packaging |
| Scanning Probe Microscope (SPM) | The NanoVision module uses a pressure head as a probe to perform 3D scanning imaging on the sample surface, with a positioning accuracy of 1nm and a scanning range of 100 μ m × 100 μ m (optional 500 μ m × 500 μ m). Accurate imaging of indentation morphology can be performed before and after testing. | Characterization of indentation morphology, measurement of crack length, precise positioning of testing area, surface roughness |
| NanoBlitz 3D/4D Mechanical Atlas | High speed mechanical performance distribution map (3D) and tomography scan (4D). Perform a large number of indentation on the sample surface at a rate of several points per second to generate a color mechanical parameter distribution map. The 4D option supports high strain rate measurement. | Composite materials, weld areas, multiphase alloys, gradient materials |
| High temperature nanoindentation | Conduct nanoindentation testing in high temperature environments to study the mechanical behavior changes and phase transitions of materials under thermal stress. It can measure the changes in hardness and modulus from room temperature to 800 ° C. | High temperature alloys, thermal barrier coatings, battery materials, structural ceramics |
| Viscoelastic characteristic test | Using CSM technology to oscillate the indenter in contact state, measure the complex modulus, storage modulus, loss modulus, and tan delta of polymers and soft materials. The frequency range covers multiple orders of magnitude. | Polymer, gel, biological tissue, biological material |
| Creep and strain rate sensitivity | Monitor the variation of indentation depth over time under constant load and measure the creep response of the material. The strain rate sensitivity index of thin film metal materials can be evaluated to predict long-term service reliability. | Solder alloys, metal films, high-temperature structural materials |
测量原理
The KLA G200X nanoindentation instrument adopts an instrumental indentation testing method, using a specific geometric shape diamond indenter (usually a Berkovich triangular pyramid indenter) to precisely control the load quasi-static indentation on the material surface, record the load and indentation depth changes in real time during the entire loading unloading process, and generate a load displacement curve. By using the classic Oliver Pharr method to analyze the initial slope (contact stiffness) of the unloading curve segment, combined with the area function of the indenter geometry, the nanohardness (H) and reduced elastic modulus (Er) of the material are accurately calculated, and the Young's modulus (E) is derived.
The XP electromagnetic pressure head system of G200X is its core technological advantage. Compared to traditional piezoelectric or electrostatic drives, electromagnetic drives have a wider force displacement dynamic range and higher control accuracy. The optional CSM module can superimpose small high-frequency oscillation forces during the loading process, and obtain real-time continuous variation curves of hardness and modulus with the depth of compression. The NanoVision SPM scanning probe microscope uses an indenter as a probe to perform high-precision 3D scanning imaging of the sample surface before and after testing, with a resolution of 1nm step size, achieving accurate measurement of indentation morphology and crack length. It is an essential tool for fracture toughness assessment.
产品参数
| Product model | KLA G200X | brand | KLA (formerly Agilent/Nano Indenter) |
| Pressure head type | Electromagnetic driven XP indentation head | load range | 1 μ N-1N (standard)/expandable to 10N |
| Maximum indentation depth | ＞500μm | Displacement resolution | Better than 0.01nm |
| Data collection rate | Up to 100kHz | stroke | 1.5mm (maximum) |
| XY sample stage | 100mm × 100mm (standard) | Z-axis travel | 25mm |
| optical microscope | High resolution optical microscope (optional dual objective lens) | vibration isolation system | Built in high stiffness vibration isolation frame |
| meet the standard | ISO 14577 | software platform | NanoSuite+InView (optional) |
| Pressure head type | Berkovich、 Multiple options including solid angle, Vickers, flat bottom, sphere, etc |
| Main options | NanoVision SPM scanning probe microscope, NanoBlitz 3D/4D, CSM continuous stiffness measurement, ProbeDM polymer testing, AccuFilm thin film method, scratch/wear testing, high-temperature nanoindentation (up to 800 ° C), DataBurst high-speed acquisition, TrueTest I-V electrical testing, active isolation system |
| For more parameters and customized configurations, please contact us for more information |
实测数据展示
高速硬度和模量测量
高温机械测试
客户评价
G200X is the absolute mainstay of nanomechanical characterization in our laboratory. The wide load range of XP electromagnetic indenter allows us to complete all tests from cell tissue (μ N level) to engineering alloys (N level) with one instrument. The SPM scanning imaging function can directly observe the indentation morphology and cracks after indentation, which is indispensable for evaluating the fracture toughness of ceramics. NanoBlitz 3D enables us to quickly draw the hardness distribution map of the heat affected zone of the weld seam, greatly improving testing efficiency. ”
——Nanomechanical characterization platform of a national key laboratory of materials science
In semiconductor process development, the continuous stiffness measurement of G200X's CSM enables us to accurately analyze the depth profile mechanical properties of low-k dielectric thin films and accurately identify the interface position between the film and the substrate. The scratch testing module helped us evaluate the scratch resistance of different thin film materials in the CMP process. The system has excellent stability, and data repeatability allows us to confidently use test results for process decision-making. ”
——Thin Film Process Development Department of a semiconductor chip manufacturer
The high-temperature nanoindentation function of G200X is crucial for our study of the mechanical properties of thermal barrier coatings for aircraft engines. The wide temperature range testing capability from room temperature to 800 ° C allows us to simulate the mechanical response of coatings under actual service conditions. The ProbeDM module also helped us characterize the viscoelastic properties of high-temperature sealing materials, providing key data support for new material selection. ”
——High temperature coating research group of a certain aviation materials research institute
Frequently Asked Questions (FAQ)
What is the difference between G200X and iNano? How should I choose?
G200X is a flagship nanoindentation platform, while iNano is a high-performance desktop nanoindentation instrument. Core difference: ① Load range: G200X covers 1 μ N-10N (six orders of magnitude), iNano covers 3nN-50mN; ② Maximum pressure depth: G200X>500 μ m, iNano is 50 μ m; ③ SPM imaging: G200X optional NanoVision SPM scanning probe microscope, iNano not applicable; ④ Application positioning: G200X is suitable for research scenarios that require fracture toughness assessment, high load testing, SPM imaging, and high temperature testing; INano is suitable for rapid measurement of conventional hardness/modulus, soft material testing, and QC inspection. If the core requirements include fracture toughness, SPM imaging, or high load testing, choose G200X; If the main needs are daily hardness modulus measurement and soft material analysis, iNano has a higher cost-effectiveness.
What is the function of G200X SPM scanning probe microscope?
NanoVision SPM is one of the core differentiating features of G200X. It uses a diamond indenter as a scanning probe to perform high-precision 3D scanning imaging of the sample surface before and after nanoindentation testing, with a positioning accuracy of 1nm step size and a scanning range of 100 μ m × 100 μ m (optional 500 μ m × 500 μ m). Main purpose: ① Accurately locate the testing area (such as specific grains, phase boundaries, or microstructures); ② Characterize the residual morphology of indentation and pile up/sink in effects; ③ Accurate measurement of indentation angle crack length for fracture toughness (KIC) calculation; ④ Detect the surface roughness and defects of the sample. This function is crucial for conducting ceramic fracture toughness assessment, thin film failure analysis, and microstructure orientation testing.
Can G200X measure fracture toughness? How to achieve it?
Sure, this is the unique ability of G200X combined with SPM functionality. Testing process: First, apply a sufficiently large load on the material surface using Berkovich or cube corner indenter to generate indentation and corner cracks. Then, use NanoVision SPM to scan the indentation area to obtain high-resolution 3D images and accurately measure the crack length. By combining the relationship between indentation load and crack length, the fracture toughness (KIC) of the material is calculated using classical fracture mechanics models such as the Laugier model or Anstis model. This method has important value in the mechanical characterization of brittle materials such as ceramics, glass, and hard coatings.
The load range of G200X can be extended to 10N. What application requires such a large load?
The 10N extended load mainly meets the following application requirements: ① hardness testing of hard engineering materials (such as hard alloys, tool steel, engineering ceramics), which have small indentation at low loads and are difficult to accurately measure; ② The mechanical properties characterization of thick coatings (tens to hundreds of micrometers) requires a sufficiently large indentation depth to avoid surface effects; ③ Macroscopic hardness mapping of welded joints and heat affected zones; ④ Vickers hardness equivalent test of metal materials (benchmarking with macroscopic hardness values); ⑤ Macroscopic mechanical performance evaluation of composite materials. The standard 1N load has covered most nanoindentation applications, and the 10N extension provides complete mechanical characterization capabilities from nanoscale to macroscopic for G200X.
What types of indenters does G200X support? What scenarios are they applicable to?
G200X supports multiple interchangeable diamond indenters: ① Berkovich (triangular pyramid) - the most commonly used nanoindentation indenter, suitable for hardness and modulus measurement, with the same equivalent cone angle as the Vickers indenter; ② Cube Corner - sharper cone angle, stronger stress concentration, suitable for fracture toughness testing and cracking in brittle materials; ③ Vickers - Four sided pyramid indenter, suitable for macroscopic hardness equivalent testing and ISO 14577 standard testing; ④ Flat bottomed indenter - suitable for compression testing of soft materials and biological tissues to avoid local damage caused by sharp indenters; ⑤ Spherical indenter - suitable for measuring stress-strain curves and simulating Hertz contact conditions. All indenters can be quickly replaced, and the system automatically identifies the type of indenter and calls the corresponding calibration parameters.
What is the highest temperature nanoindentation of G200X? What are the applications?
The high-temperature nanoindentation option of G200X can be heated up to 800 ° C (depending on the configuration, there are usually two heating stations available: 400 ° C and 800 ° C). The main applications of high-temperature nanoindentation include: ① studying the mechanical behavior changes of materials under thermal stress (the trend of hardness and modulus changes with temperature); ② Characterize the material failure mechanism in thermomechanical processes such as hot pressing and hot isostatic pressing; ③ Quantify the brittle ductile transition temperature (DBTT) of materials at the nanoscale; ④ Evaluate the mechanical properties of high-temperature alloys, thermal barrier coatings, and ceramic matrix composites at service temperatures; ⑤ Mechanical stability assessment of battery materials in high-temperature working environments. The system is equipped with independent heating and temperature control modules to ensure the stability and uniformity of temperature during the testing process.
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Free Sample Testing Service
Not sure if your material is suitable for G200X nanoindentation testing? We offer free sample testing services! Send us samples, and our professional engineers will use G200X to conduct nanomechanical testing for you, providing detailed test reports and analysis recommendations.
