Filmetrics F32 In-line Film Thickness Measurement System
Production-line integrated multi-channel optical film thickness gauge — simultaneously monitors 4 process points, digital I/O remote control, automatic SPC data export
1～4 Simultaneous monitoring channels | 15nm～250μm Thickness range (config dependent) | 380～1700nm Wavelength range (config dependent) | 3U Rack-mount chassis height |
Product Introduction
Filmetrics F32 In-line Film Thickness Measurement System is a multi-channel optical film thickness gauge designed specifically for production environment integration. Built on the proven F20 series spectral reflectance measurement technology, it packages the core spectral analysis system in a half-width 3U rack-mount chassis, with additional spectrometer modules enabling simultaneous monitoring of up to 4 independent process points (EXR and UVX versions support up to 2 positions), completing film thickness measurements across all channels within seconds.
The F32 is specifically designed for production line in-line monitoring — supporting remote start/stop/reset control via digital I/O interfaces or host software, with measurement data automatically exported to SPC systems for statistical process control, enabling closed-loop process management. Optional lens assemblies allow fast adaptation to existing production equipment mounting interfaces, making it easy to integrate into semiconductor process tools, vacuum deposition chambers, continuous coating production lines, or roll-to-roll (R2R) equipment — a true in-line film thickness measurement core module.
Integration AdvantageF32 is the in-line model in the Filmetrics series specifically designed for equipment integration. The half-width 3U rack-mount chassis fits semiconductor equipment electrical cabinets, multi-channel parallel measurement enables real-time monitoring at multiple points, and digital I/O and software interfaces support full automation control — the ideal in-line film thickness measurement module for CVD/PVD deposition tools, wet etching systems, and continuous coating production lines.
Why Choose F32? — Five Core Advantages for In-line Integration
【Multi-Channel Parallel Monitoring · Boosts Production Efficiency】The F32 standard configuration supports simultaneous connection and monitoring of up to 4 measurement probe channels (EXR/UVX versions support up to 2). It can simultaneously detect film thickness changes across different chambers of the same equipment or different areas of the same substrate, eliminating the need for multiple independent film thickness gauges and significantly reducing equipment procurement and integration costs — a true multi-channel in-line film thickness measurement system.
【Digital I/O Remote Control · Seamless Production Line Integration】The F32 features standard digital I/O interfaces supporting remote start/stop/reset control via external PLC or host software. Measurement data is automatically exported to the factory SPC system for real-time statistical process control, enabling automated data collection, recording, and trend analysis — meeting the integration requirements of semiconductor fabs and equipment OEMs for in-line film thickness testing.
【3U Rack-Mount Chassis · Standard Equipment Integration】The F32 uses a half-width 3U rack-mount package that can be directly installed into the electrical cabinets of semiconductor process equipment, completing film thickness measurements and data processing without requiring an external computer or standalone industrial PC. Optional lens assemblies allow measurement probes to be integrated onto process chambers of existing production equipment via fiber optic connections for non-contact in-line film thickness monitoring.
【Broad Spectrum Configurations · Flexible Selection】The F32 offers multiple wavelength configurations: standard version 380-1050nm, EXR version extends to 1700nm, and UVX version covers 190-1700nm. Different wavelength ranges correspond to different film thickness measurement ranges and material applicability. Users can flexibly select based on process requirements, meeting in-line measurement needs from ultra-thin photoresist to thicker optical coatings.
【Pre-built Material Library · Rapid Deployment】The FILMeasure software includes a material optical constant database with 100+ materials, covering common semiconductor process films, optical coating materials, and polymer coatings. The system deploys quickly, enabling in-line film thickness monitoring to begin without tedious material modeling, significantly reducing equipment integration and process tuning time.
F32 vs Benchtop Film Thickness Gauges
In the Filmetrics series, the F20 and F50 are benchtop film thickness gauges designed for laboratory and manual operation, while the F32 is an in-line film thickness measurement module designed specifically for production equipment integration. Both share the same core measurement technology, but their product form, control methods, and application scenarios are completely different:
| Comparison Dimension | F32 In-line Film Thickness Measurement System | F20/F50 Benchtop Film Thickness Gauge |
|---|
| Product Form | 3U rack-mount module, integrated into equipment cabinet | Standalone benchtop instrument with sample stage |
| Measurement Channels | 1～4 channels parallel measurement | Single channel measurement |
| Control Method | Digital I/O remote control, host software control | Manual operation, mouse/keyboard control |
| Data Output | Automatic export to SPC system | Manual save, data viewing |
| Typical Applications | Equipment integration, in-line process monitoring, production automation | Laboratory R&D, QC inspection, manual measurement |
Typical In-line Integration Application Scenarios
The core value of the F32 lies in "embedding film thickness measurement into production equipment". It is not a standalone measurement instrument, but an in-line film thickness monitoring module integrated into semiconductor process tools, coating production lines, or automated manufacturing lines, providing critical data for real-time process control. The most typical application scenarios are:
| Application Area | In-line Measurement Scenario Description | Typical Measurement Objects |
|---|
| Semiconductor Process Tool Integration | Integrate F32 into CVD, PVD, ALD, etching and other semiconductor process tools for real-time in-line monitoring of film thickness during deposition or etching. Multi-channel capability simultaneously monitors process status across multiple chambers, with data fed back via SPC systems for automatic process control. | SiO₂/SiNx deposited film thickness, photoresist thickness, polysilicon layer, CMP removal amount |
| Continuous Coating Production Lines | Deploy multiple F32 measurement probes on large continuous coating production lines for in-line thickness detection on different areas of moving substrates. Data automatically uploads to the production line control system, supporting real-time SPC monitoring and automatic coating parameter adjustment. | Optical coatings, ITO transparent conductive films, hard coatings, decorative coatings |
| Roll-to-Roll (R2R) Processes | In flexible electronics and thin-film solar cell R2R production, the F32 integrates into winding equipment for in-line non-contact thickness measurement of moving flexible substrates, enabling real-time monitoring of large-area film uniformity. | Flexible ITO films, OLED functional layers, organic solar cell films, barrier films |
| MOCVD/MBE Epitaxy Monitoring | The F32 can be integrated with optional lens assemblies onto process chambers of MOCVD or MBE epitaxy equipment, performing non-contact in-line thickness and optical constant measurement through optical viewports, monitoring epitaxial layer growth rate and thickness in real-time. | GaN epitaxial layers, InGaN/GaN quantum wells, AlGaN films |
| Biomedical Coating Production Lines | Integrate F32 into coating production lines for drug-eluting stents, catheters, and other medical devices, performing in-line coating thickness and uniformity inspection to ensure compliance with strict coating thickness specifications. | Drug coatings, parylene coatings, hydrophilic coatings |
Measurement Principle
The F32 uses the same spectral reflectance method as the F20 series for non-contact film thickness measurement. Incident light reflects off the upper and lower surfaces of the film, and the two reflected beams interfere due to optical path differences, producing an interference spectrum. By analyzing the oscillation frequency of the interference spectrum, the system precisely calculates film thickness within seconds while also deriving material refractive index (n) and extinction coefficient (k). Unlike benchtop film thickness gauges, the F32 packages the spectrometer, light source, and analysis software in a 3U rack-mount module, connected via fiber optics to each measurement probe channel, supporting digital I/O remote control — a film thickness measurement system specifically designed for equipment integration and in-line monitoring.
Product Parameters
| Product Model | F32 | Product Form | 3U half-width rack-mount module |
| Measurement Technology | Spectral Reflectance | Measurement Channels | 1-4 (EXR/UVX versions support up to 2) |
| Wavelength Range (Standard) | 380 – 1050nm | Wavelength Range (EXR) | 380 – 1700nm |
| Wavelength Range (UVX) | 190 – 1700nm | Light Source | Halogen lamp |
| Thickness Measurement Range | 15nm – 70μm (Standard) / Up to 250μm (EXR/UVX) | Measurement Accuracy | 0.02nm |
| Spot Size | 0.007 × probe-to-sample distance | Control Interface | Digital I/O, host software control |
| Data Output | Automatic export to SPC system | Material Database | 100+ materials, expandable |
| Software | FILMeasure (supports single and multi-layer film analysis, remote control, automatic data export) |
| Optional Accessories | Lens assembly (adapts to existing production equipment), multi-channel spectrometer module, UV/NIR extension options |
| For more parameters and integration solutions, please contact us |
Actual Test Data Display
Customer Reviews
"The F32 is the standard in-line film thickness module for our thin-film deposition tools. The 3U rack-mount design installs directly into the equipment electrical cabinet, with 4 channels simultaneously monitoring film thickness changes across different chambers. The digital I/O interface communicates seamlessly with our equipment PLC. Film thickness data automatically uploads to the factory SPC system, achieving the leap from manual sampling to full in-line monitoring."
—— Process Integration Department, Semiconductor Equipment Manufacturer
"After deploying F32 on our continuous coating production line, we achieved real-time in-line monitoring of coating thickness. The multi-channel design allows simultaneous measurement at different positions on the substrate. The automatic data recording and trend analysis features have greatly reduced manual inspection costs. The integration process went smoothly — the lens assembly helped us quickly adapt to the mounting interfaces of existing equipment."
—— Production Process Department, Optical Coating Manufacturer
Frequently Asked Questions (FAQ)
What is the core difference between F32 and F20?
Both use the same core spectral reflectance measurement technology, but their product positioning is completely different. The F20 is a standalone benchtop film thickness gauge suitable for laboratory and manual single-point measurements. The F32 is an in-line film thickness measurement module designed specifically for production equipment integration, featuring a 3U rack-mount package, support for up to 4 measurement channels of parallel monitoring, digital I/O remote control, and automatic SPC data export. If your requirement is to integrate film thickness measurement functionality into process tools or production lines, the F32 is the only choice.
How many measurement probes can the F32 connect simultaneously?
The standard F32 supports up to 4 measurement probe channels working simultaneously via additional spectrometer modules, with each channel independently monitoring film thickness changes at a process point. The EXR and UVX versions support up to 2 channels due to their broader spectral ranges. Channels can be flexibly configured to meet multi-chamber equipment or large-area substrate multi-point monitoring needs.
How does the F32 integrate with production line PLC or SPC systems?
The F32 provides standard digital I/O interfaces supporting external PLC triggering of start/stop/reset measurement operations. Additionally, the FILMeasure software supports automatic export of measurement data to factory SPC systems for real-time statistical process control of film thickness data. The software also provides API interfaces for deep integration with equipment host software.
How to choose among the three F32 wavelength configurations?
The standard version (380-1050nm) is suitable for most transparent film in-line measurements, with thickness range of 15nm-70μm. The EXR version (380-1700nm) extends into the near-infrared band for measuring thicker films (up to 250μm) and some infrared-transparent materials. The UVX version (190-1700nm) covers UV to NIR full spectrum, suitable for ultra-thin films (down to a few nanometers) and broad-spectrum applications. Selection is primarily based on the target film's thickness range and optical properties. Contact application engineers for professional selection recommendations.
What is the purpose of the F32 lens assembly?
The lens assembly is an optional mounting adapter accessory used to connect the F32 measurement probe via fiber optics to process chambers or viewports of existing production equipment. It provides standardized optical interfaces, enabling rapid F32 integration into CVD tools, vacuum deposition chambers, or continuous coating lines without major modifications to existing equipment, achieving in-line film thickness measurement.
Both F32 and F60-t are production-line film thickness gauges. How to choose?
They address different production-line scenarios: The F60-t is a complete wafer film thickness measurement station equipped with an R-Theta motorized stage and SECS/GEM interface, suitable for high-volume wafer film thickness automated inspection in wafer fabs. The F32 is a film thickness measurement module without a built-in stage, designed to be integrated into existing process tools or production lines for real-time in-line film thickness monitoring via multi-channel probes. If you need a standalone production measurement station, choose the F60-t. If you need to embed film thickness measurement functionality into thin-film deposition equipment or continuous production lines, choose the F32.
Related Product Recommendations
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View Details →Free Sample Testing Service
Free Sample Testing Service
Not sure if your samples are suitable for F32 in-line film thickness measurement? We offer free sample testing services! Send us your samples, and our professional engineers will conduct film thickness testing and provide detailed measurement reports and production line integration recommendations.
