Filmetrics® F40 Microscopic Film Thickness Gauge
Upgrade your microscope into a micro-area film thickness measurement system — spot size as small as 1μm, measure patterned, curved, and non-uniform samples
1μm Minimum measurement spot | 4nm～350μm Thickness measurement range | 0.02nm Measurement accuracy | <1 second Single point measurement time |
Product Introduction
Filmetrics F40 Microscopic Film Thickness Gauge is a micro-spectroscopy system designed specifically for thin film thickness measurement in micro-scale regions. Unlike traditional standalone film thickness gauges, the F40 is not a complete measurement device on its own, but rather a spectral measurement module that seamlessly integrates into your existing microscope via a standard C-mount interface. It utilizes the microscope's optical system to focus the measurement spot down to the 1-micron level, enabling precise film thickness analysis on specific micro-areas of patterned, curved, and non-uniform sample surfaces.
The F40 is designed with the philosophy of "upgrade, not replace" — whether your laboratory is already equipped with Leica, Zeiss, Nikon, or Olympus microscopes, simply install the F40 onto the microscope's C-mount port to transform an ordinary microscope into a high-precision optical film thickness measurement system, significantly reducing equipment procurement costs. The built-in integrated color CCD camera displays the sample surface in real-time, making measurement points visually precise — truly "what you see is what you measure," completely eliminating the "blind measurement" experience of traditional film thickness gauges.
Technical HighlightsThe F40 series covers the complete spectral range from 190nm deep ultraviolet to 1700nm near-infrared. Different configurations can measure from 4nm ultra-thin films to 350μm thick film layers. F40-UV is one of the leading OLED pixel-level film thickness measurement solutions, capable of detecting potential chemical composition changes in atmosphere-sensitive materials.
Why Choose F40? — Five Core Advantages
【1μm Micro-Spot · Ultimate Precision】Say goodbye to millimeter-level spot measurement. The F40's minimum measurement spot can reach 1μm, enabling precise thickness measurement on semiconductor wafer scribe line areas, MEMS cantilever structures, and extremely small Micro-OLED pixel thin films. Spot size depends on the objective magnification — using higher magnification objectives yields smaller measurement spots, offering far greater measurement flexibility than traditional benchtop film thickness measurement equipment.
【What You See Is What You Measure · Visual Positioning】The F40 is equipped with a high-resolution color CCD camera. Through the real-time video view feature in FILMeasure software, the sample surface image is clearly displayed on the computer screen. Wherever the measurement crosshair points, that's where the spectrum is collected — visual positioning ensures every measurement is well-documented. This feature is particularly critical for complex samples such as wafers with fine patterns and internal coatings of microfluidic chips, eliminating the "blind measurement" challenge of traditional fiber optic probes that cannot precisely locate measurement positions.
【Microscope Upgrade · Non-Invasive Modification】The F40 connects to the microscope via a standard C-mount interface, which is the industry-standard video camera mount for microscopes. No need to replace your expensive metallurgical microscope; no modifications to the original optical path — plug and play, setup is complete within minutes and measurement can begin immediately. This "low-cost upgrade" model breathes new life into existing laboratory equipment.
【Full Spectrum Configurations · Flexible Selection】The F40 series offers multiple wavelength configurations covering from 190nm UV to 1700nm NIR. UV configurations are ideal for ultra-thin film measurement (down to 4nm), EXR configurations cover wide spectral ranges, and NIR configurations are specifically designed for infrared-transparent materials like silicon substrates. The main differences between configurations lie in wavelength range and thickness measurement range, allowing users to flexibly select based on actual application scenarios.
【Built-in Material Library · Intelligent Analysis】The included FILMeasure software features a built-in material library with over 500 material optical constants, covering common thin film materials across semiconductor, display, optical coating, and biomedical industries. Supports single-layer and multi-layer film analysis — a single measurement simultaneously provides film thickness, refractive index (n), and extinction coefficient (k). The software also supports offline data analysis, historical data tracking, and graphical result visualization, meeting various R&D and QC requirements.
Typical Micro-Area Film Thickness Measurement Scenarios
The core value of the F40 lies in solving the "micro-area film thickness measurement challenge." Traditional film thickness gauges, with their large spot sizes (typically millimeter-level), cannot measure specific areas of patterned samples. The F40's 1μm spot completely changes this landscape. Below are the most typical application scenarios for the F40:
| Application Area | Measurement Scenario Description | Typical Measurement Objects |
|---|
| Semiconductor Manufacturing | Film thickness monitoring in wafer scribe line areas, thickness measurement at specific locations on patterned chips. Traditional film thickness measurement equipment cannot enter scribe lines due to large spot sizes; the F40's micron-scale spot enables direct positioning and measurement. | Photoresist thickness, oxide/nitride films, polysilicon layers, dielectric layers |
| IC Failure Analysis (FA) | In IC chip failure analysis, precise determination of remaining dielectric layer thickness after front-side layer removal is required. The F40 can precisely measure film thickness at specific chip failure areas, providing critical data support for fault localization. | Remaining dielectric thickness, passivation layers, inter-metal dielectric |
| OLED/LCD Display | OLED displays consist of multiple film material combinations, requiring pixel-level thickness measurement of various organic and inorganic layers. The F40-UV configuration enables non-contact film thickness measurement on individual pixels while simultaneously detecting potential chemical composition changes in atmosphere-sensitive materials. | OLED emissive/injection/buffer layers, ITO transparent electrodes, LC cell gap, polyimide alignment layers |
| MEMS (Micro-Electromechanical Systems) | MEMS devices contain complex 3D microstructures such as cantilevers, deep trenches, and thin film structures, requiring non-destructive film thickness measurement at specific micro-locations. The F40 can precisely position to specific locations on MEMS structures for film thickness analysis. | Silicon membranes, aluminum nitride/zinc oxide thin film filters, photoresist sacrificial layers, structural layer thickness |
| Biomedical Coatings | Functional coatings on medical devices (catheters, stents, guidewires, balloons) are typically only a few to tens of microns thick and applied on curved surfaces. The F40's non-contact measurement method requires no sample preparation and can directly measure coating thickness on device surfaces without causing damage. | Parylene coatings, drug-eluting stent coatings, hydrophilic lubricious coatings, insulating coatings |
| Porous Silicon Films | Porous silicon is widely used in optical instruments, gas sensors, and medical devices. The F40 includes a unique analysis algorithm that simultaneously obtains layer thickness, refractive index, and porosity of porous silicon with a single measurement, eliminating reliance on low-accuracy methods such as traditional gravimetric measurement. | Porous silicon layer thickness, porosity, refractive index |
F40 Series Selection Guide
The main differences between F40 series models lie in wavelength range and thickness measurement range. As a general rule: shorter wavelengths measure thinner films, while longer wavelengths penetrate thicker or more opaque film layers. Please select the appropriate configuration based on your actual measurement requirements. (Measurement range under 10x objective, optional)
| Model | Thickness Range | Wavelength Range | Typical Application Scenarios |
|---|
| F40-UV | 4nm～35μm | 190～1100nm | Ultra-thin film micro-area measurement (OLED pixel layers, DUV photoresist, ultra-thin optical coatings) |
| F40-UVX | 4nm～115μm | 190～1700nm | Wide-spectrum ultra-thin to thick film measurement, covering UV to NIR full spectrum |
| F40 (Standard) | 20nm～45μm | 400～850nm | General micro-area film thickness measurement (semiconductor process films, photoresist, polymer coatings) |
| F40-EXR | 20nm～115μm | 400～1700nm | Thicker film micro-area measurement (optical coatings, silicon layers, MEMS structural layers) |
| F40-NIR | 40nm～115μm | 950～1700nm | Near-infrared micro-area measurement (silicon substrate thick films, compound semiconductors, infrared-transparent materials) |
Not sure which configuration to choose? Contact an engineer for recommendations
F40 vs F20/F50 Comparison
| Comparison Dimension | F20 | F40 | F50 |
|---|
| Product Positioning | Standalone single-point film thickness gauge | Microscope-integrated micro-area measurement module | Fully automatic film thickness Mapping system |
| Minimum Spot Size | 1.5mm (standard) | 1μm (objective-dependent) | 1.5mm (standard) |
| Core Capability | Fast single-point thickness and refractive index measurement | Precise micro-area film thickness measurement | Automated scanning of large-area thickness distribution |
| Typical Use | Fast testing of uniform films | Patterned samples, micro-area positioning measurement | Wafer/substrate film thickness uniformity analysis |
| Microscope Required | No | Yes (integrates with user's existing microscope) | No |
Measurement Principle
The F40 utilizes spectral reflectance for non-contact film thickness measurement. White light from the microscope objective illuminates the sample surface, and incident light reflects off both the upper and lower surfaces of the film. The two reflected beams interfere due to optical path differences, producing an interference spectrum. By analyzing the oscillation frequency of the interference spectrum, the F40 can precisely calculate film thickness within 1 second, while simultaneously deriving material refractive index (n) and extinction coefficient (k). Unlike the F20/F50, the F40 utilizes the microscope objective to focus incident light to a micron-level spot, enabling measurement on specific micro-areas of the sample surface — a capability traditional benchtop film thickness gauges cannot achieve.
Product Parameters
| Measurement Technology | Spectral Reflectance | Microscope Interface | Standard C-mount |
| Wavelength Range | 190nm～1700nm (configuration-dependent) | Light Source | Internal microscope illuminator |
| Thickness Measurement Range | 4nm～350μm (configuration-dependent) | Spot Size | 1μm～100μm (objective and configuration-dependent) |
| Measurement Accuracy | 0.02nm | Stability | 0.05nm |
| Measurement Functions | Film thickness, refractive index n, extinction coefficient k, reflectance, transmittance |
| Software | FILMeasure (built-in 130+ material database, supports single and multi-layer film analysis) |
| Optional Accessories | Motorized autofocus, XY motorized stage, NIST-traceable thickness standards |
| Contact us for more parameters, custom configurations, and compatibility information |
Actual Measurement Data Display
Customer Reviews
"The F40 microscope film thickness gauge is one of the most frequently used devices in our failure analysis laboratory. During IC chip fault localization, we need to precisely measure the remaining dielectric layer thickness after removing the passivation layer in specific circuit areas. The F40's 1μm spot can directly target the micro-area of the chip failure point, with real-time video to confirm measurement positions. The results are accurate and reliable. The device was installed directly on our existing Leica microscope without taking up additional bench space, and the upgrade cost was far lower than purchasing a new standalone film thickness gauge."
—— Failure Analysis Laboratory, Semiconductor Wafer Manufacturer
"In OLED new display device development, we need micro-area thickness measurement of organic film layers in different pixel regions. Traditional film thickness gauges simply cannot position at the pixel level. The F40-UV UV configuration, combined with 100x objective, enabled us to achieve pixel-level film thickness characterization for the first time. What's even more impressive is that the F40's UV spectrum can also detect chemical composition changes of OLED organic materials in air, which is extremely valuable for material stability assessment. The device was installed on our existing Olympus microscope, and commissioning took less than half an hour."
—— Device Development Department, New Display Technology R&D Center
"Our medical devices require multiple functional coatings on both the inner and outer surfaces of catheters with diameters under 2mm, and coating thickness directly impacts product performance. Previously, measuring these curved small samples was extremely difficult. The F40 allows us to directly select measurement points on the catheter surface, and the non-contact method doesn't damage the coating. The built-in material database with 130+ materials covers commonly used medical materials like parylene and hydrophilic coatings, significantly improving measurement efficiency."
—— R&D Quality Department, Medical Device Manufacturer
Frequently Asked Questions (FAQ)
Which microscope brands is the F40 compatible with?
The F40 connects to microscopes via a standard C-mount interface, which is the industry-standard video camera mount for microscopes. Therefore, the F40 is compatible with the vast majority of microscopes equipped with C-mount interfaces on the market, including mainstream metallurgical or stereo microscopes from Leica, Zeiss, Nikon, Olympus, and other major brands.
What conditions are required to achieve the F40's 1μm spot?
The F40's measurement spot size depends on the microscope objective magnification and configuration. Typically, when using 40x or higher magnification objectives, 1μm-level measurement spots can be achieved. Under standard configuration, the spot size can be adjusted from 1μm to 100μm. It should be noted that the smaller the spot, the lower the light throughput into the spectrometer, resulting in somewhat reduced measurement signal-to-noise ratio. Therefore, it is recommended to select the appropriate spot size based on actual sample conditions.
What is the difference between F40 and F20, and how should I choose?
The core difference lies in measurement approach and application scenarios: The F20 is a standalone film thickness gauge with a 1.5mm standard spot, suitable for fast single-point measurement of large-area uniform films. The F40 is a microscope-integrated module with a 1μm micro-spot, suitable for precise positioning measurement of patterned samples and micro-areas. If your samples are uniform films and do not require micro-area positioning, the F20 is more economical and convenient. If you need to measure specific chip areas, MEMS microstructures, or OLED pixels, the F40 is the only choice.
Does installing the F40 require modifying the microscope's original structure?
Absolutely not. The F40 installs onto the microscope via a standard C-mount interface — a non-invasive connection method that does not modify any of the microscope's original optical path or structure. The installation process simply involves securing the F40's MA-Cmount adapter onto the microscope's C-mount port, connecting the USB cable to the computer, and setup is complete within minutes. After removing the F40, the microscope can immediately be restored to its original state.
Can the F40 measure scribe line areas on patterned wafers?
Yes, this is one of the F40's core advantages. Traditional film thickness gauges, with their large spot sizes (millimeter-level), simply cannot enter scribe lines that are only tens of microns wide. The F40's 1μm micro-spot can precisely position specific locations within scribe lines, with real-time CCD video to confirm measurement positions, enabling accurate thickness measurement of oxide/nitride films, photoresist residues, and more. This capability is of significant value in semiconductor process monitoring and IC failure analysis.
Can the F40 measure the porosity of porous silicon?
Yes. The F40 includes a unique porous silicon analysis algorithm that simultaneously obtains layer thickness, refractive index, and porosity from a single measurement. In contrast, traditional gravimetric measurement methods have lower accuracy. The F40's optical method is not only non-destructive and fast, but also enables micro-area analysis, making it suitable for R&D and quality inspection needs in optical instruments, gas sensors, and medical devices utilizing porous silicon.
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View Details →Free Sample Testing Service
Free Sample Testing Service
Not sure if your micro-area samples are suitable for F40 measurement? We offer free sample testing services! Send us your samples, and our engineers will perform micro-area film thickness testing using the F40, providing you with a detailed measurement report and solution recommendations.
