Filmetrics F54-XYT-300 Automatic Measurement Optical Film Thickness Gauge | 300mm Wafer Fully Automatic Film Thickness Mapping System

Filmetrics F54-XYT-300 Automatic Optical Film Thickness Gauge

300mm wafer fully automatic film thickness measurement | XY stage + high-performance R-Theta rotating stage | Spectral reflectance technology | Up to 2 points per second

Filmetrics F54-XYT-300 Automatic Measurement Optical Film Thickness Gauge

4nm~120μm

Thickness range (config dependent)

0.02nm

Measurement repeatability

300mm

Max sample diameter

2 pts/sec

Scanning speed

2~100μm

Spot size (config dependent)

Product Introduction

Filmetrics F54-XYT-300 Automatic Measurement Optical Film Thickness Gauge builds upon the F54-XY-200 by adding a high-performance rotating sample stage (R-Theta), designed specifically for fully automatic film thickness measurement of 300mm large-size wafers. Using spectral reflectance technology, it can measure both patterned and unpatterned samples across five configurations, covering film thickness from 4nm to 120μm, with spot size from 2μm to 100μm, and wavelength range from 190-1700nm. The electric XY stage combined with a high-performance rotating table automatically moves to preset measurement points, with measurement speed up to 2 points per second, accuracy of 1nm or 0.2%, repeatability of 0.02nm, and stability of 0.05nm. Equipped with an integrated microscope and real-time camera, it supports micro-measurement of patterned surfaces and is suitable for rougher materials. Built-in dozens of polar, rectangular, and linear mapping patterns, supporting custom unlimited measurement point arrays. Suitable for fully automatic thickness uniformity testing of large-size wafers in industries such as 300mm semiconductor wafer manufacturing, compound semiconductors, LCD/OLED displays, optical coatings, MEMS, biomedical films, photovoltaic solar energy, and more.

KLA Instruments

Specially designed for fully automatic film thickness measurement of 300mm large-size wafers, supporting patterned and unpatterned samples, automatic focusing and pattern recognition, real-time video imaging, and onboard reflectance standard film.

Core Advantages

300mm wafer fully automatic mapping

The electric XY stage combined with a high-performance R-Theta rotating table automatically moves to preset measurement points, enabling fully automatic film thickness distribution mapping of 300mm large-size wafers.

High-speed mapping capability

Maximum measurement speed of 2 points per second, completing a complete thickness distribution map for large-area 300mm wafers in a short period of time.

Broad range and high precision

Five configurations cover a thickness range from 4nm to 120μm with 0.02nm repeatability, providing comprehensive coverage from ultra-thin to thick films.

Patterned sample support

Integrated autofocus and pattern recognition functions enable precise measurement of designated micro-areas on patterned wafers or devices.

Real-time imaging and tracking

Built-in integrated camera provides real-time imaging, and the advanced history recording function can save, reproduce, and export measurement results.

Flexible mapping modes

Built-in dozens of polar, rectangular, and linear mapping patterns, supporting custom unlimited measurement point arrays.

Applicable Film Types

Oxide/Nitride

Photoresist/Polymer

ITO/TCO electrodes

Optical coatings (TiO₂/SiO₂)

Amorphous/Poly-Si

Semiconductor films

OLED organic layers

Hard/AR coatings

Biomedical coatings

Multi-layer stacks

*Suitable for transparent, semi-transparent, and low absorption coefficient films, supporting both patterned and unpatterned samples.

Measurement Principle

The F54-XYT-300 uses spectral reflectance (white light interferometry) technology. White light is vertically directed onto the film surface, and the reflected light from the upper and lower interfaces of the film creates a characteristic interference spectrum. By analyzing the oscillation frequency and amplitude of the spectrum, film thickness can be accurately calculated—denser oscillations indicate thicker films—while also deriving optical constants such as refractive index (n) and extinction coefficient (k). Combined with the electric XY stage and high-performance R-Theta rotating table, the system can rapidly perform multi-point measurements on a 300mm wafer and construct a complete 2D/3D film thickness distribution map.

Typical Industrial Applications

Industry	Typical Applications and Film Layers
Semiconductor Manufacturing	300mm wafer oxide/nitride thickness measurement, photoresist uniformity analysis, amorphous/poly-Si film thickness measurement
Compound Semiconductors	Thickness and uniformity detection of GaAs, SiC and other compound semiconductor films
LCD/OLED Display	ITO/TCO sheet resistance correlation, LC cell gap, polyimide, OLED organic layer thickness mapping
Optical Coatings	AR/HR multi-layer film thickness control, hard coating, filter coating uniformity testing
MEMS	Microstructure thin film thickness characterization and critical layer monitoring
Photovoltaic Solar	Anti-reflection layer thickness optimization, TCO electrode layer uniformity measurement

Product Parameters

Product Model	F54-XYT-300	Brand	Filmetrics (KLA)
Measurement Technology	Spectral Reflectance (non-contact)	Stage Type	Electric XY + R-Theta rotating stage
Max Sample Size	300mm diameter	Stage Travel	200mm x 200mm (XY) + rotation
Thickness Range	4nm~120μm (config dependent)	Repeatability	0.02nm
Accuracy	1nm or 0.2%, whichever is greater	Stability	0.05nm
Spot Size	2μm~100μm (config dependent)	Wavelength Range	190nm~1700nm (config dependent)
Scanning Speed	Up to 2 points per second	Measurement Functions	Thickness, refractive index, reflectivity, absorptivity, surface roughness
Software Features	FILMapper software, automated mapping modes (polar/rectangular/linear/custom), 2D/3D distribution maps, SPC, multi-layer modeling, history recording
Standard Accessories	Integrated spectrometer/light source module, microscope adapter, reflectance standard film, real-time camera
For more parameters and custom configurations, please contact Unicorn Technology

F54-XY Series Selection Guide

Model	Stage Type	Max Sample	Thickness Range	Wavelength Range
F54-XY-200	Electric XY stage	200mm	4nm~120μm	190~1700nm
F54-XYT-300	XY stage + R-Theta rotating	300mm	4nm~120μm	190~1700nm

F54-XYT-300 adds a high-performance rotating sample stage to the F54-XY-200, optimized for 300mm wafers. Not sure which model to choose? Contact an engineer for recommendations →

Measurement Data Display

Typical 300mm wafer film thickness distribution map and pattern recognition

Customer Reviews

The R-Theta rotating stage on the F54-XYT-300 enabled us to achieve fully automatic mapping for 300mm wafer film thickness uniformity detection. After setting up the measurement program, the system automatically completes all point measurements and generates distribution maps with 0.02nm repeatability, fully meeting the control requirements of advanced processes.

—— Semiconductor Wafer Foundry, Quality Engineer

The pattern recognition function on the F54-XYT-300 can accurately locate measurement points in pixel areas for ITO and organic layer thickness mapping used in OLED panels. The 2D/3D thickness charts are very intuitive, helping us quickly identify process deviations and optimize parameters.

—— Display Panel Manufacturer, Process Development Department

Frequently Asked Questions (FAQ)

What are the main differences between F54-XYT-300 and F54-XY-200?+

The F54-XYT-300 adds a high-performance R-Theta rotating sample stage to the F54-XY-200, specifically designed for fully automatic film thickness measurement of 300mm large-size wafers. The F54-XY-200 uses only an electric XY stage, which supports up to 200mm samples.

What is the maximum sample size that can be measured?+

The F54-XYT-300 can support circular wafer samples up to 300mm in diameter. The electric XY stage has a travel of 200mm × 200mm, and combined with the high-performance rotating stage, it achieves full-size coverage.

Can it measure patterned samples?+

Yes. The F54-XYT-300 supports measurement of both patterned and unpatterned samples. The system is equipped with autofocus and pattern recognition software for precise positioning of preset micro-area measurement points.

What is the thickness measurement range?+

It depends on the specific configuration. The F54-XY series offers five wavelength configurations with thickness ranges from 4nm to 120μm. The UV configuration is suitable for ultra-thin films (from 4nm), while NIR and EXR configurations are suitable for thicker film layers (up to 120μm).

What mapping modes does the software support?+

The FILMapper software supports multiple preset mapping modes including polar, rectangular, and linear patterns, as well as user-defined measurement points with no limit on the number of points. The system has dozens of standard mapping patterns built in for rapid measurement recipe creation.

Free Sample Testing Service

Not sure if the F54-XYT-300 is suitable for your 300mm wafer film thickness analysis needs? We offer free sample testing services! Send us your samples, and our professional engineers will conduct fully automatic thickness measurement and analysis, providing you with detailed thickness distribution reports and selection recommendations.