Filmetrics F60-t Automatic Light Reflective Film Thickness Gauge
A fully automatic film thickness measurement system designed specifically for production line environments - automatic notch detection, closed measurement, SECS/GEM factory automation
5nm～3mm Thickness measurement range (depending on configuration) | 0.02nm Measurement accuracy | 190～1700nm Wavelength range (depending on configuration) | 150μm Minimum measurement spot |
Product Introduction
Filmetrics F60-t Automatic Light Reflective Film Thickness Gauge is a fully automatic thin film thickness measurement system designed specifically for production environments. Building on the mature film thickness mapping technology of the F50 series, it adds a range of key production-line features: Automatic Notch Finding automatically identifies wafer orientation and accurately locates the measurement starting point; Built-in automatic baseline calibration ensures the system is in optimal condition before each measurement; Closed measurement platform with motion interlock provides safety protection and reduces ambient light interference; Industrial computer with pre-installed software enables immediate use upon startup, eliminating additional installation and setup. Additionally, the F60-t can be upgraded with a fully automatic wafer transfer system and supports the SECS/GEM factory automation software protocol, enabling direct interface with the Manufacturing Execution System (MES) on the production line for true integration into automated semiconductor manufacturing processes.
The F60-t employs the same advanced spectral reflectance technology as the F50, automatically moving to preset measurement points via a motorized R-Theta stage to complete precise measurement of film thickness and refractive index (n and k values) within seconds. The system comes standard with 4-inch, 6-inch, and 200mm reference wafers and TS-SiO2-4-7200 thickness standard wafers for daily calibration and verification. Each system includes a built-in optical constant database of over 500 materials and integrated online diagnostic functions to ensure high availability and low maintenance costs for production line equipment.
Dedicated for production lineF60-t is the flagship model in the Filmetrics series specifically designed for production environments. It builds upon the mature optical film thickness measurement technology of the F50 by adding automatic notch detection, automatic baseline calibration, a fully enclosed measurement platform, and SECS/GEM factory automation protocol for seamless integration into semiconductor factory automated production lines. Different models are distinguished by wavelength range, with shorter wavelengths suitable for thinner films and longer wavelengths suitable for thicker, rougher, and less transparent films.
Why choose F60-t? — Six core advantages at the production line level
[Automatic notch positioning · One-click start]The F60-t features automatic notch detection, automatically identifying wafer notch orientation and using it as a reference to determine all measurement points without manual alignment. This feature fully automates the measurement process after wafer loading, significantly reducing human operational errors — a truly automated wafer film thickness measurement device.
[Automatic baseline calibration · Continuous precision]With built-in reflectance standard and automatic baseline calibration function, the system automatically performs spectral baseline calibration before each measurement, ensuring measurement consistency and data reliability during long-term continuous operation. This is critical for long-term stable operation of film thickness measurement equipment on the production line, eliminating the need for frequent manual calibration.
[Fully enclosed measurement platform · Safe and reliable]The F60-t is equipped with a closed measurement stage with motion interlock device. During measurement, the protective cover is locked to ensure operator safety while effectively isolating ambient light interference on spectral measurement, ensuring measurement stability under complex lighting conditions on the production line.
[SECS/GEM factory automation · Seamless integration]The F60-t supports the SECS/GEM factory automation software protocol, enabling direct communication with the factory's Manufacturing Execution System (MES) and Automated Material Handling System (AMHS) for automatic measurement task issuance, automatic data upload, and remote monitoring. This is an essential capability for production line film thickness testing equipment, allowing film thickness detection to be truly integrated into automated production processes.
[Fully automatic wafer transfer · Unmanned operation]The F60-t can be upgraded to a fully automatic wafer transfer model, working with automatic wafer cassette loading and robotic arm loading/unloading to achieve unmanned operation throughout the entire process from wafer loading, measurement, to data output — meeting the stringent requirements of semiconductor mass production fabs for automated film thickness measurement equipment.
[Industrial grade reliability · Easy maintenance]The F60-t's industrial computer with pre-installed software is ready to use upon startup, with built-in online diagnostic functions for real-time system status monitoring and rapid fault location. 24/7 telephone and email technical support from experienced application engineers ensures high availability and rapid fault recovery for production line equipment.
F60-t vs F50 Comparison
The F60-t and F50 share the same core spectral reflectance film thickness measurement technology, but they target completely different usage scenarios. The F50 primarily serves R&D laboratories and QC testing, emphasizing manual and flexible operation. The F60-t is specifically designed for mass production fabs, adding a series of essential production-line functions.
| Comparison Dimension | F50 Automatic Mapping Film Thickness Gauge | F60-t Automatic Light Reflective Film Thickness Gauge |
|---|
| Product Positioning | Laboratory/R&D Automatic Mapping Measurement System | Dedicated automatic film thickness measurement system for production line/mass production environment |
| Core Measurement Technology | Same — Spectral Reflectance, R-Theta Motorized Stage, Mapping Automatic Point Sampling |
| Automatic Notch Detection | No | ✓ Automatically identifies wafer orientation |
| Automatic Baseline Calibration | No | ✓ Built-in reflectance standard, automatic baseline correction |
| Measurement Stage | Open | Fully enclosed, with motion interlock safety protection |
| Computer | External PC (user provided or optional) | Industrial computer with pre-installed software, ready to use |
| Factory Automation | Not supported | Supports SECS/GEM protocol, upgradeable to fully automatic wafer transfer |
| Typical Application Scenarios | R&D laboratory, process development, small batch QC testing | In-line film thickness detection for semiconductor wafer fab mass production lines and large-scale production lines |
Typical Application Scenarios
The core value of the F60-t lies in seamlessly integrating high-precision film thickness measurement into mass production processes. It not only delivers the same measurement performance as the F50 but also achieves the leap from manual operation to automated production through dedicated production-line features. The following are the most typical application scenarios of the F60-t:
| Application Field | Production Line Measurement Scenario Description | Typical Measurement Objects |
|---|
| Semiconductor Wafer Manufacturing | Automated film thickness detection on wafer fab production lines. The F60-t uses automatic notch positioning to quickly locate the measurement starting point, automatically completes multi-point mapping of the entire wafer according to the preset recipe, and uploads data to the factory MES system via SECS/GEM for SPC statistical process control. Can be integrated with automated material handling systems for fully automatic wafer film thickness detection. | Photoresist thickness, oxide/nitride films, polysilicon layer, dielectric layer, CMP polished film thickness, films on sapphire/SiC/GaN substrates |
| LCD/OLED Display Manufacturing | Automated multi-point film thickness measurement of glass substrates on display panel production lines. The F60-t operates stably in production line environments, with a closed stage unaffected by workshop lighting and automatic baseline calibration ensuring data consistency during long-term continuous operation. Supports automated multi-point film thickness detection on large-area substrates. | LCD cell gap, polyimide alignment layer, ITO/TCO transparent conductive film, OLED functional layers |
| Optical Coating Mass Production | Batch product film thickness detection on optical coating production lines. Through the SECS/GEM interface and integration with coating equipment, automatic film thickness detection and data feedback after coating are achieved, forming closed-loop process control that effectively improves coating yield and production efficiency. | Hard coating, anti-reflective film, optical filter, dielectric mirror |
| Wafer Backside Thinning | Thickness measurement after wafer backside thinning processes. Near-infrared models in the F60-t series (such as F60-t-NIR, F60-t-s1310, etc.) can penetrate silicon substrates to directly measure the remaining thickness of thinned wafers, providing critical data for wafer thinning process control on the production line. | Thinned silicon wafer thickness, remaining Taiko wafer thickness |
| Compound Semiconductor Mass Production | Measurement of epitaxial layer thickness and substrate thickness on production lines for compound semiconductor wafers such as SiC, GaN, GaAs, etc. The F60-t's wide wavelength coverage meets the optical measurement needs of different material systems, and automation features ensure consistency and efficiency in large-scale wafer measurements. | GaN epitaxial layer, SiC substrate thickness, GaAs thin film, LiTaO3 substrate |
| Biomedical Device Mass Production | Automated coating thickness testing on medical device mass production lines. The closed measurement platform ensures cleanroom compatibility, the non-contact measurement method does not damage products, and enables on-line film thickness sampling or 100% inspection of large product volumes. | Drug-eluting stent coating, parylene coating, catheter hydrophilic coating, biosensor films |
Measurement Principle
The F60-t uses the same spectral reflectance method as the F50 for non-contact film thickness measurement. Incident light reflects off the upper and lower surfaces of the film, and the two reflected beams interfere due to optical path differences, producing an interference spectrum. By analyzing the oscillation frequency of the interference spectrum, the system precisely calculates film thickness within seconds while also deriving material refractive index (n) and extinction coefficient (k). The motorized R-Theta stage automatically moves to preset measurement points, combined with automatic notch positioning and baseline calibration, achieving full process automation from wafer loading to data output.
F60-t Series Selection Guide
The main difference between different models in the F60-t series is wavelength range and thickness measurement range. As a general principle: shorter wavelengths (UV-visible) are suitable for thinner films, while longer wavelengths (near-infrared) are suitable for thicker, rougher, and less transparent films.
| Model | Thickness Range | Wavelength Range | Typical Application Scenarios |
|---|
| F60-t-UV | 5nm～40µm | 190～1100nm | Ultra-thin film production line measurement (photoresist, OLED functional layer, ultra-thin optical coating) |
| F60-t-UVX | 5nm～250µm | 190～1700nm | Wide spectrum ultra-thin to thick film production line measurement, covering UV to NIR full spectrum |
| F60-t | 20nm～70µm | 380～1050nm | General production line film thickness measurement (semiconductor process films, polymer coatings) |
| F60-t-EXR | 20nm～250µm | 380～1700nm | Thicker film production line measurement (optical coatings, silicon layers, MEMS structural layers) |
| F60-t-NIR | 100nm～250µm | 950～1700nm | Near-infrared production line measurement (thick films on silicon substrates, compound semiconductors) |
| F60-t-XT | 0.2µm～450µm | 1440～1690nm | Infrared thick film production line measurement (silicon film thickness, wafer backside thinning) |
| F60-t-s1310 | 7µm～2mm | 1280～1340nm | Ultra-thick film production line measurement (specific materials, silicon-based thick films) |
| F60-t-s1550 | 10µm～3mm | 1520～1580nm | Extremely thick film production line measurement (ultra-thick silicon wafers, large-sized substrates) |
Not sure which configuration to choose? Contact an engineer for recommendations
Product Parameters
| Measurement Technology | Spectral Reflectance | Stage Type | Motorized R-Theta stage |
| Wavelength Range | 190nm~1700nm (depending on configuration) | Light Source | Tungsten halogen lamp |
| Thickness Range | 5nm~3mm (depending on configuration) | Measurement Accuracy | 0.02nm |
| Spot Size | Standard 1.5mm (minimum down to 150μm) | Accuracy | 1nm or 0.2%, whichever is greater |
| Stability | 0.05nm | Material Database | 130+ built-in, expandable |
| Measurement Stage | Fully enclosed, with motion interlock safety protection | Computer | Industrial computer with pre-installed software |
| Automation Features | Automatic notch positioning, automatic baseline calibration, online diagnostics |
| Factory Automation | Supports SECS/GEM protocol (optional), upgradeable to fully automatic wafer transfer |
| Standard Accessories | 4-inch, 6-inch, and 200mm reference wafers, TS-SiO2-4-7200 thickness standard wafer, vacuum pump |
| Software | FILMeasure (130+ material library, single and multi-layer film analysis) |
| For more parameters and custom configurations, please contact us |
Actual Test Data Display
Customer Reviews
"The F60-t has enabled us to achieve true automation in wafer production film thickness detection. The automatic notch positioning function eliminates manual alignment, and the enclosed measurement platform allows the equipment to be deployed directly next to the production line without worry about ambient light interference. The SECS/GEM protocol seamlessly integrates with our factory's MES system, with all measurement data automatically uploaded and SPC monitoring real-time online, significantly reducing error rates from manual recording and data transcription."
—— Manufacturing Department, 8-inch Semiconductor Wafer Foundry
"Upgrading from F50 to F60-t was a critical step in our production line automation transformation. The automatic baseline calibration function eliminates the need for manual calibration every shift, significantly improving data consistency during 24/7 continuous operation. The industrial computer is ready to use upon startup, coupled with online diagnostic functions that greatly reduce equipment maintenance. Now one operator can manage three F60-t units simultaneously, tripling detection efficiency."
—— Mass Production Process Department, Compound Semiconductor Device Manufacturer
"The near-infrared configuration of the F60-t perfectly solves the on-line thickness measurement needs of our wafer backside thinning process. Previously, wafers had to be taken to the lab for specialized equipment measurement. Now the F60-t is deployed directly next to the thinning tool, with robotic arm automatic loading/unloading completing full-wafer thickness mapping in just minutes. The SECS/GEM interface provides real-time feedback of measurement results to the thinning equipment, achieving closed-loop process control and increasing product yield by approximately 8%."
—— Wafer Thinning Process Department, Power Semiconductor Device Manufacturer
Frequently Asked Questions (FAQ)
What is the core difference between F60-t and F50?
Both share the same core measurement technology (spectral reflectance, R-Theta motorized stage), but target different usage scenarios. The F50 is designed for laboratory and R&D environments, emphasizing manual and flexible operation. The F60-t is specifically designed for production line environments, adding automatic notch positioning, automatic baseline calibration, fully enclosed measurement stage (with motion interlock), pre-installed software industrial computer, and SECS/GEM factory automation protocol. If your requirement is automated film thickness measurement in a production line environment, the F60-t is the only option. If it's laboratory R&D or small-scale QC testing, the F50 offers better cost-effectiveness.
What specific functions can the F60-t's SECS/GEM protocol achieve?
SECS/GEM is a factory automation communication protocol standard in the semiconductor industry. Through this protocol, the F60-t can communicate with the factory's Manufacturing Execution System (MES) and Automated Material Handling System (AMHS), enabling automatic issuance of measurement tasks (MES → F60-t), automatic upload of measurement data (F60-t → MES), remote monitoring of equipment status, and real-time data support for SPC statistical process control. This makes the F60-t a standard film thickness detection node on the production line, seamlessly integrated into the automated production process of semiconductor factories.
What are the benefits of the F60-t's closed measurement stage?
The closed measurement stage offers three major benefits: First, safety protection — the motion interlock device locks the protective cover during measurement, ensuring operator safety. Second, ambient light isolation — the complex lighting environment of production line workshops is effectively isolated by the fully enclosed design, ensuring spectral measurement data reliability. Third, cleanroom compatibility — the enclosed structure reduces particle entry into the measurement area, making it more suitable for automated film thickness measurement in cleanroom environments.
Can the F60-t be upgraded to fully automatic wafer transfer?
Yes. The F60-t supports upgrading to a fully automatic wafer transfer model, working with automatic wafer cassette loading and robotic arm loading/unloading to achieve unmanned operation throughout the entire process from wafer loading, measurement, to data output. This upgrade is particularly important for semiconductor production lines pursuing high automation, and can be integrated with factory Automated Material Handling Systems (AMHS) to further improve production line film thickness measurement efficiency.
How to choose among different F60-t series models?
F60-t series selection is primarily based on wavelength range and thickness measurement range: UV configurations are suitable for ultra-thin film measurement (photoresist, OLED film layers), standard configurations are suitable for general semiconductor process films, EXR configurations cover a wider spectral range, and near-infrared configurations (NIR/XT/s1310/s1550) are suitable for thick films, silicon substrates, and specialty materials. General principle: thinner films require shorter wavelengths; thicker, rougher, and more opaque films require longer wavelengths. Please contact our application engineers for professional selection advice based on your specific film material and thickness range.
Is F60-t maintenance and calibration complex?
The F60-t's maintenance design fully considers production line environment requirements. The automatic baseline calibration function uses a built-in reflectance standard, automatically completing spectral baseline calibration before each measurement without manual intervention. The system comes standard with 4-inch, 6-inch, and 200mm reference wafers and TS-SiO2-4-7200 thickness standard wafers for daily calibration and verification. Built-in online diagnostic functions monitor system status in real-time and rapidly locate faults. Additionally, each system comes standard with Monday-Friday 24-hour telephone, email, and online technical support from experienced application engineers.
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View Details →Free Sample Testing Service
Free Sample Testing Service
Not sure if your samples are suitable for film thickness measurement on the F60-t production line? We offer free sample testing services! Send us your samples, and our engineers will use the F60-t to conduct automated film thickness testing, providing detailed measurement reports and production line deployment recommendations.
